XC7A200T-2FB676I

IC FPGA 400 I/O 676FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 400 13455360 215360 676-BBGA, FCBGA

Quantity 440 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-2FB676I – Artix-7 FPGA, 215,360 Logic Elements, 676-FCBGA

The XC7A200T-2FB676I is an Artix-7 field programmable gate array (FPGA) IC offering a high logic density and on-chip memory in a compact FCBGA package. Designed for industrial-grade applications, it provides a combination of extensive logic resources, embedded RAM, and a broad I/O count for complex digital designs.

This device targets designs that require substantial programmable logic, significant embedded memory, and reliable operation across an extended temperature range while maintaining surface-mount packaging for board-level integration.

Key Features

  • Core Logic  Approximately 215,360 logic elements to implement complex digital functions and large-scale logic networks.
  • Embedded Memory  Approximately 13.46 Mbits of on-chip RAM for data buffering, FIFOs, and state storage.
  • I/O Capacity  400 user I/O pins to support wide external interfacing and parallel connectivity.
  • Power  Specified voltage supply range of 950 mV to 1.05 V to meet the device’s power requirements.
  • Package & Mounting  676-FCBGA (27×27) package, surface-mount construction for compact board integration; package case listed as 676-BBGA, FCBGA.
  • Industrial Temperature Range  Rated for operation from –40°C to 100°C, suitable for extended-temperature environments.
  • Regulatory  RoHS compliant to align with material and environmental requirements.

Unique Advantages

  • High-density programmable logic: The large logic element count enables implementation of substantial custom digital processing without external ASICs or CPLDs.
  • Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM reduces the need for external memory in many buffering and data-path applications.
  • Extensive I/O resources: 400 I/O pins provide flexibility for interfacing to multiple peripherals, buses, and parallel data streams.
  • Industrial-grade thermal range: Operation from –40°C to 100°C supports deployment in environments with wide temperature variation.
  • Compact BGA footprint: 676-FCBGA (27×27) package offers dense integration for space-constrained boards while supporting surface-mount assembly.
  • Compliance-ready: RoHS compliance simplifies material conformity for many product lines.

Why Choose XC7A200T-2FB676I?

The XC7A200T-2FB676I positions itself as a high-capacity Artix-7 FPGA option for industrial designs that require substantial programmable logic, embedded memory, and extensive I/O in a compact BGA package. Its specified voltage supply and extended operating temperature range make it suitable for robust deployments where board-level integration and environmental tolerance are important.

This device is well suited for engineering teams seeking to consolidate logic and memory onto a single programmable device to reduce component count and simplify design iterations, while benefiting from industry-aligned material compliance.

Request a quote or submit a sales inquiry to receive pricing, lead-time, and availability information for the XC7A200T-2FB676I.

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