XC7A200T-2FBG484I

The XC7A200T-2FBG484I is an AMD Artix-7 Field Programmable Gate Array (FPGA) IC providing 215,360 logic elements and approximately 13.46 Mbits of embedded memory in a 484-ball FCBGA package. It delivers a high logic density and a large I/O count in a surface-mount BGA footprint.

Built for industrial-grade applications, the device supports an operating temperature range of -40 °C to 100 °C and a core supply range of 950 mV to 1.05 V, making it suitable for designs that require substantial on-chip logic, memory and I/O integration under extended temperature conditions.

Key Features

• Core Logic 215,360 logic elements provide capacity for complex digital designs and high-density logic integration.
• Embedded Memory Approximately 13.46 Mbits of on-chip RAM for buffering, FIFOs and other memory-intensive functions.
• I/O Count 285 user I/Os to support dense external interfaces and multi-channel connectivity.
• Package & Mounting 484-FCBGA (484-BBGA) supplier device package in a 23 × 23 form factor; surface mount for board-level integration.
• Power Core supply range of 950 mV to 1.05 V to match system power rails and design constraints.
• Temperature Range Industrial operating range of -40 °C to 100 °C for reliable operation in demanding environments.
• Compliance RoHS compliant.

Typical Applications

• High-density logic integration — Use the large logic element pool for complex control, protocol bridging, or custom processing pipelines.
• Memory-intensive functions — Approximately 13.46 Mbits of embedded RAM supports buffering, packet processing and deep FIFO implementations.
• Multi-channel interfacing — 285 I/Os enable aggregation of sensors, transceivers or parallel peripherals in a single device.

Unique Advantages

• High logic capacity: 215,360 logic elements allow consolidation of large designs into a single FPGA, reducing board complexity.
• Substantial on-chip memory: Approximately 13.46 Mbits of RAM minimizes external memory needs for many applications.
• Generous I/O: 285 user I/Os provide flexibility for dense external connectivity and multi-channel designs.
• Industrial temperature rating: -40 °C to 100 °C supports deployment in extended-temperature environments.
• Compact, surface-mount package: 484-FCBGA (23 × 23) enables high-density PCB layouts while keeping a small board footprint.
• RoHS compliant: Meets common environmental requirements for electronic manufacturing.

Why Choose XC7A200T-2FBG484I?

The XC7A200T-2FBG484I positions itself as a high-capacity, industrial-grade FPGA option within the Artix-7 family, combining large logic resources, significant embedded memory and a high I/O count in a compact 484-ball FCBGA package. Its specified operating range and RoHS compliance make it appropriate for designs that require robustness and environmental conformity.

This device is well suited for engineering teams needing to consolidate complex digital functions, implement memory-heavy architectures, or support dense external interfacing while maintaining a compact board footprint and industrial temperature tolerance.

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