XC7A200T-2FFG1156C

The XC7A200T-2FFG1156C is an Artix-7 FPGA from AMD delivering a high-density programmable logic platform in a 1156-ball FCBGA package. It provides substantial on-chip resources including 215,360 logic elements and approximately 13.46 Mbits of embedded RAM, together with up to 500 user I/O pins.

Designed for surface-mount PCB assembly and commercial-grade operation (0°C to 85°C), this device supports low-voltage core operation with a supply range of 0.95 V to 1.05 V and is RoHS compliant.

Key Features

• Core Logic Capacity — 215,360 logic elements provide substantial programmable logic for complex custom designs.
• Configurable Logic Blocks — Built with 16,825 CLBs to organize and map logic functions efficiently.
• Embedded Memory — Approximately 13.46 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• I/O Density — Up to 500 user I/Os to support wide interfacing and high-pin-count system connectivity.
• Power — Core supply range from 0.95 V to 1.05 V to match low-voltage system designs.
• Package & Mounting — 1156-ball FCBGA (1156-BBGA) with a 35×35 mm footprint, designed for surface-mount assembly.
• Operating Conditions — Commercial temperature grade rated for 0°C to 85°C.
• Compliance — RoHS compliant for environmental conformity.

Typical Applications

• High-density digital logic — Use the large logic element count to implement complex custom digital functions and algorithm acceleration.
• Embedded memory buffering — The device’s approximately 13.46 Mbits of on-chip RAM supports local data storage and buffering within FPGA designs.
• Multi‑I/O interfacing — Up to 500 I/Os enable broad connectivity for systems requiring many external signals or parallel interfaces.

Unique Advantages

• Large programmable fabric: 215,360 logic elements provide room to consolidate multiple functions into a single device, reducing overall BOM and board complexity.
• Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM helps minimize external memory needs and improves data locality.
• High I/O count: 500 user I/Os allow flexible interfacing and support for high-pin-count systems without extensive external multiplexing.
• Compact FCBGA package: 1156-ball, 35×35 mm FCBGA package delivers high density in a surface-mount form factor suited to modern PCB layouts.
• Commercial-grade readiness: Rated for 0°C to 85°C operation and RoHS compliant for broad deployment in commercial applications.
• Low-voltage core operation: Core supply between 0.95 V and 1.05 V aligns with low-power system designs and modern power rails.

Why Choose XC7A200T-2FFG1156C?

The XC7A200T-2FFG1156C positions itself as a high-capacity Artix-7 FPGA option for designers who need extensive programmable logic, ample embedded memory, and a large number of I/Os in a single surface-mount package. Its combination of 215,360 logic elements, approximately 13.46 Mbits of RAM, and 500 I/Os enables consolidation of complex functions onto one device, simplifying board design and reducing component count.

With a 1156-ball FCBGA footprint, commercial temperature rating, and RoHS compliance, this FPGA is suited to commercial electronic designs that require scalable logic resources, dense I/O, and low-voltage core operation backed by the Artix-7 family heritage.

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