XC7A200T-1FBG676I

IC FPGA 400 I/O 676FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 400 13455360 215360 676-BBGA, FCBGA

Quantity 1,325 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-1FBG676I – Artix-7 Field Programmable Gate Array (FPGA), 215,360 logic elements

The XC7A200T-1FBG676I is an Artix-7 Field Programmable Gate Array (FPGA) offered in a 676-FCBGA surface-mount package (27 × 27 mm). Key device characteristics include 215,360 logic elements, approximately 13.5 Mbits of embedded memory, and 400 available I/O pins.

This industrial-grade device operates from a core supply of 950 mV to 1.05 V and supports an operating temperature range of −40 °C to 100 °C, providing a compact, high-density programmable logic option in a ball-grid array package.

Key Features

  • Core Logic  215,360 logic elements provide the device's primary programmable resources for implementing custom digital logic.
  • Embedded Memory  Approximately 13.5 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive functions.
  • I/O Capacity  400 I/O pins to support broad external connectivity and interfacing requirements.
  • Package & Mounting  676-BBGA (676-FCBGA, 27×27 mm) in a surface-mount package for compact board-level integration.
  • Power  Core voltage supply range of 950 mV to 1.05 V for the device core power domain.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployments requiring extended temperature tolerance.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 215,360 logic elements enable substantial programmable logic integration within a single device, reducing the need for multiple FPGAs.
  • Significant on-chip memory: Approximately 13.5 Mbits of embedded RAM helps minimize external memory requirements and simplifies board design.
  • Extensive I/O: 400 I/O pins offer flexibility for interfacing with a wide range of peripherals and external components.
  • Compact BGA footprint: 676-FCBGA (27×27) surface-mount package provides a space-efficient form factor for high-density designs.
  • Industrial temperature range: −40 °C to 100 °C rating supports applications that require extended temperature tolerance.
  • Low-voltage core operation: 950 mV to 1.05 V supply range aligns with low-voltage power domains common in modern systems.

Why Choose XC7A200T-1FBG676I?

XC7A200T-1FBG676I positions itself as a high-density, industrial-grade FPGA option that consolidates substantial logic, memory, and I/O capacity into a compact 676-FCBGA package. The combination of 215,360 logic elements, approximately 13.5 Mbits of embedded RAM, and 400 I/O pins makes it suitable for designs that prioritize on-chip resources and board-level integration.

With a low-voltage core supply range and extended operating temperature window, this Artix-7 device offers predictable electrical and thermal characteristics for long-term deployments where industrial-grade operation and RoHS compliance are required.

Request a quote or submit a purchase inquiry for XC7A200T-1FBG676I to receive pricing and availability information tailored to your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up