XC7A200T-1FB676I

The XC7A200T-1FB676I is an Artix-7 field programmable gate array (FPGA) IC from AMD, offering a large programmable logic fabric and embedded memory in a high-density FCBGA package. It is intended for designs that require substantial logic capacity, on-chip RAM, and a wide operating temperature range for industrial use.

Key Features

• Logic Capacity — 215,360 logic elements to support complex, high-density digital designs.
• Configurable Logic Blocks — 16,825 CLBs for structured logic implementation and resource partitioning.
• Embedded Memory — approximately 12.8 Mbits of embedded memory for buffering, caching, and on-chip data storage.
• I/O Density — 400 user I/O pins to accommodate high-pin-count interfaces and multiple external peripherals.
• Power Supply — core voltage range of 950 mV to 1.05 V supporting standard FPGA power domains.
• Package & Mounting — 676-BBGA / 676-FCBGA (27x27) package; surface-mount device suitable for compact board-level integration.
• Operating Range — Industrial-grade operation from -40 °C to 100 °C for extended temperature deployments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control: Large logic capacity and extended temperature range make this FPGA suitable for industrial automation and control systems.
• High-density I/O Systems: 400 I/O pins enable integration with multiple sensors, interfaces, and external devices in compact designs.
• Memory-intensive Designs: Approximately 12.8 Mbits of on-chip RAM supports buffering and data-path optimization in embedded systems.
• Custom Computing and Acceleration: Extensive logic elements provide the resources needed for hardware acceleration and specialized compute functions.

Unique Advantages

• Large programmable fabric: 215,360 logic elements provide the headroom to implement complex logic, state machines, and custom datapaths.
• Significant on-chip memory: Approximately 12.8 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching tasks.
• High I/O count: 400 I/Os simplify board-level routing for multi-interface systems and enable flexible pin assignment.
• Industrial temperature rating: -40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact, surface-mount package: 676-FCBGA (27x27) enables high-density PCB designs while maintaining robust packaging for industrial applications.
• Regulatory compliance: RoHS status supports environmentally conscious product development and supply-chain compliance.

Why Choose XC7A200T-1FB676I?

The XC7A200T-1FB676I positions itself as a high-capacity, industrial-grade FPGA option that combines a large number of logic elements, substantial embedded memory, and a high I/O count in a compact 676-FCBGA package. Its voltage and temperature specifications align with industrial design requirements, making it suitable for applications that demand robustness and scalability.

This device is appropriate for engineering teams building complex digital systems that require on-chip resources to minimize external components, optimize board space, and maintain operation across extended temperature ranges. Its combination of logic, memory, and I/O density delivers long-term design flexibility as project requirements evolve.

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