XC7A200T-1FB484I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,308 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 16825 | Number of Logic Elements/Cells | 215360 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13455360 |
Overview of XC7A200T-1FB484I – Artix-7 Field Programmable Gate Array (FPGA), 215,360 logic elements, 285 I/O, 484-FCBGA
The XC7A200T-1FB484I is an Artix-7 Field Programmable Gate Array (FPGA) offered in a 484-BBGA / FCBGA package. It provides large programmable logic capacity, substantial on-chip memory, and a high I/O count in a surface-mount industrial-grade device.
Key electrical and environmental parameters include a core supply range of 950 mV to 1.05 V and an operating temperature range of -40 °C to 100 °C, making it suitable for designs that require robust thermal performance and low-voltage core operation.
Key Features
- Core logic 215,360 logic elements (cells) for implementing large finite-state machines, datapaths, and custom logic functions.
- Embedded memory Approximately 13.46 Mbits of on-chip RAM (Total Ram Bits: 13,455,360) to support buffering, FIFOs, and local data storage.
- I/O capacity 285 user I/O pins to support multi-channel interfaces and complex routing requirements.
- Power Core voltage supply range of 950 mV to 1.05 V to match low-voltage system designs.
- Package and mounting Surface-mount device in a 484-BBGA / FCBGA package; supplier device package listed as 484-FCBGA (23x23) for dense board-level integration.
- Temperature and grade Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS-compliant.
Typical Applications
- Industrial control and automation Industrial-grade temperature rating and large logic capacity enable complex control algorithms and real-time processing in factory and process automation systems.
- High-density I/O systems The 285 I/O pins and abundant logic resources support protocol bridging, multi-channel I/O expansion, and custom interface logic.
- Embedded memory–dependent processing Approximately 13.46 Mbits of on-chip RAM provides local storage for buffering, data staging, and algorithm state in embedded signal or data processing tasks.
- Low-voltage system designs Core supply range of 950 mV to 1.05 V allows integration into modern low-voltage power architectures.
Unique Advantages
- High programmable density: 215,360 logic elements enable large and complex designs without external programmable logic.
- Significant on-chip RAM: Approximately 13.46 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage needs.
- Large I/O count: 285 I/O pins provide flexibility for multi-protocol interfacing and system integration.
- Industrial operating range: -40 °C to 100 °C supports deployments in harsh and temperature-variable environments.
- Compact, surface-mount package: 484-BBGA / 484-FCBGA (23x23) package delivers high package density for space-constrained PCBs.
- Low-voltage core operation: 950 mV to 1.05 V supply supports modern low-power system designs.
Why Choose XC7A200T-1FB484I?
The XC7A200T-1FB484I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial programmable logic, embedded memory, and I/O in a compact surface-mount package. Its electrical and thermal specifications support integration into low-voltage and temperature-demanding applications.
This device is well suited for engineers and procurement teams seeking a programmable platform that balances logic density, on-chip memory, and a high I/O count while meeting industrial temperature and RoHS requirements.
Request a quote or submit a pricing inquiry to check availability and receive detailed purchasing information for the XC7A200T-1FB484I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








