XC7A200T-1FBG676C

The XC7A200T-1FBG676C is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, provided in a 676‑ball FCBGA surface-mount package. It delivers high logic density, substantial embedded memory, and a large I/O count for programmable logic designs.

Designed for commercial-grade applications, this device is suited to designs that require up to 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and up to 400 I/O pins while operating within a 0 °C to 85 °C range.

Key Features

• Artix-7 FPGA core Implements the Artix-7 family architecture for programmable logic in a high-density device configuration.
• Logic capacity 215,360 logic elements to implement complex digital functions and large-scale FPGA designs.
• Embedded memory Approximately 13.46 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive functions.
• I/O resources Up to 400 I/O pins to support broad interfacing and custom peripheral connectivity.
• Power supply Core voltage range 0.95 V to 1.05 V to match system power rails and design requirements.
• Package and mounting 676‑ball FCBGA (27 × 27 mm) package, surface-mount for compact board integration.
• Commercial temperature and grade Rated for 0 °C to 85 °C operating temperature and classified as Commercial grade.
• Regulatory compliance RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic element count to implement complex algorithms, state machines, and custom datapaths.
• Memory-centric designs — Approximately 13.46 Mbits of embedded memory supports buffering, packet processing, and local data storage.
• Custom I/O and protocol bridging — Up to 400 I/O pins enable flexible interfacing with sensors, transceivers, and peripheral devices.
• Compact system boards — The 676‑ball FCBGA, surface-mount package (27 × 27 mm) is suited for space-constrained PCB layouts.

Unique Advantages

• High logic density: 215,360 logic elements provide the capacity to consolidate multiple functions into a single device and reduce overall system complexity.
• Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O count: 400 I/O pins support broad interfacing options and simplify integration of peripherals and custom I/O standards.
• Compact FCBGA package: 676‑ball FCBGA (27 × 27 mm) facilitates high-density board designs while maintaining surface-mount assembly compatibility.
• Commercial-grade operating range: Rated 0 °C to 85 °C to meet a wide range of standard commercial application environments.
• RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing processes.

Why Choose XC7A200T-1FBG676C?

The XC7A200T-1FBG676C positions itself as a high-capacity, commercially rated Artix-7 FPGA that balances logic resources, embedded memory, and I/O density in a compact FCBGA package. Its specifications make it appropriate for developers and teams implementing large programmable logic designs that require substantial on-chip RAM and flexible connectivity while remaining within commercial temperature limits.

For projects that demand consolidation of functions, reduced external component count, and a high level of on-chip resources, this FPGA provides a clear hardware foundation. Its package and electrical characteristics support integration into modern surface-mount PCB assemblies while adhering to RoHS requirements.

Request a quote or submit an inquiry to purchase the XC7A200T-1FBG676C and discuss availability and lead times for your design requirements.