XC7A200T-1FB484C

IC FPGA 285 I/O 484FCBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-BBGA, FCBGA

Quantity 945 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs16825Number of Logic Elements/Cells215360
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13455360

Overview of XC7A200T-1FB484C – Artix-7 FPGA, 215,360 logic elements, 484-FCBGA

The XC7A200T-1FB484C is an Artix-7 Field Programmable Gate Array (FPGA) IC offered in a 484-ball FCBGA package. It provides a high-capacity, commercial-grade programmable fabric combining a large number of logic elements, significant on-chip memory, and a substantial I/O count for complex digital designs.

With 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and 285 I/O, this device targets commercial embedded systems and custom logic implementations where integration, on-chip memory, and flexible I/O are primary requirements.

Key Features

  • Core Logic: 215,360 logic elements provide extensive programmable logic resources for implementing complex digital functions and custom architectures.
  • Embedded Memory: Approximately 13.46 Mbits of on-chip RAM for buffering, data storage, and implementation of memory-mapped functions within the FPGA fabric.
  • I/O Capacity: 285 user I/O pins to support a broad range of external interfaces and parallel/serial connectivity options.
  • Power Supply Range: Core voltage specified from 950 mV to 1.05 V, enabling defined core-power design and supply sequencing.
  • Package & Mounting: 484-ball FCBGA package (supplier device package: 484-FCBGA (23x23)), surface-mount for compact board-level integration.
  • Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
  • Compliance: RoHS-compliant to meet common environmental requirements for electronic assemblies.

Typical Applications

  • Commercial Embedded Systems — Use the device's 215,360 logic elements and approximately 13.46 Mbits of embedded memory to implement custom control, data processing, and protocol logic in commercial products.
  • High-Density I/O Designs — 285 I/O pins enable interfacing with multiple peripherals, sensors, and subsystems requiring parallel or high-pin-count connections.
  • Custom Logic and Prototyping — Large logic and memory capacity support development of complex algorithms and iterative hardware designs for product development and validation.

Unique Advantages

  • Large Programmable Capacity: 215,360 logic elements allow partitioning of complex systems onto a single device, reducing external components.
  • Substantial On-Chip Memory: Approximately 13.46 Mbits of embedded RAM reduces the need for external memory for many buffering and cache use cases.
  • Extensive I/O Count: 285 I/O pins simplify system integration by providing direct interfaces to numerous external devices without multiplexing compromises.
  • Compact Surface-Mount Package: 484-FCBGA packaging enables high-density board layouts while maintaining robust connectivity for large-pin-count applications.
  • Commercial Temperature Suitability: Specified for 0 °C to 85 °C operation, matching requirements for mainstream commercial deployments.
  • Regulatory Readiness: RoHS compliance supports environmental and manufacturing process requirements.

Why Choose XC7A200T-1FB484C?

The XC7A200T-1FB484C positions itself as a high-capacity, commercial-grade Artix-7 FPGA well suited for designers who need substantial logic resources, significant on-chip memory, and a large I/O complement in a surface-mount FCBGA package. Its specified core voltage range and operating temperature provide clear parameters for system power and thermal planning.

This part is ideal for teams building commercial embedded systems, complex custom logic implementations, or high-density I/O applications that benefit from integrating large amounts of logic and memory on a single, RoHS-compliant device.

Request a quote or submit a parts inquiry to get pricing and availability for the XC7A200T-1FB484C.

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