XC7A15T-L2CPG236E

The XC7A15T-L2CPG236E is an Artix-7 FPGA from AMD providing programmable logic, embedded memory and flexible I/O in a compact 238-ball LFBGA/CSPBGA package. It delivers 16,640 logic elements and approximately 0.92 Mbits of on-chip RAM, making it suitable for designs that require moderate logic density with integrated memory and I/O resources.

This device operates from a core voltage range of 0.95 V to 1.05 V, offers 106 user I/O pins, and is specified for extended-grade operation from 0 °C to 100 °C. The surface-mount 238-CSBGA (10×10) package supports compact board-level integration.

Key Features

• Logic Capacity — 16,640 logic elements to implement custom digital logic, state machines and glue logic within a single FPGA device.
• Embedded Memory — Approximately 0.92 Mbits of on-chip RAM for FIFOs, buffers and local storage to support data handling and processing tasks.
• I/O Resources — 106 user I/O pins to connect peripherals, sensors and external devices with flexible pin availability for a variety of interfaces.
• Power — Core voltage supply specified from 0.95 V to 1.05 V to support low-voltage system architectures.
• Temperature Range — Extended-grade operation from 0 °C to 100 °C for applications requiring broader commercial temperature capability.
• Package & Mounting — 238-LFBGA / CSPBGA package (supplier device package: 238-CSBGA 10×10) with surface-mount mounting for compact PCB integration.
• RoHS Compliance — Device is RoHS compliant, helping meet regulatory requirements for lead-free manufacturing.

Typical Applications

• Custom Digital Logic — Implement application-specific finite state machines, control logic and protocol handling using the device's 16,640 logic elements.
• Data Buffering and Memory Functions — Use the embedded ~0.92 Mbits of RAM for FIFOs, caches or temporary data storage in signal processing pipelines.
• I/O Expansion and Protocol Bridging — Leverage 106 I/Os to interface with peripherals, perform level translation tasks or consolidate multiple serial/parallel links.
• Compact System Integration — The 238-LFBGA surface-mount package enables dense board designs where PCB area and package height are constrained.

Unique Advantages

• High logic density: 16,640 logic elements provide capacity for substantial custom logic without external ASICs or glue components.
• Integrated memory: Approximately 0.92 Mbits of on-chip RAM reduces external memory dependence and simplifies PCB routing.
• Flexible I/O count: 106 user I/Os allow direct connection of multiple peripherals and interfaces, minimizing the need for additional I/O expanders.
• Low-voltage core operation: 0.95 V to 1.05 V core supply supports modern low-voltage system designs and power-optimized architectures.
• Compact surface-mount package: 238-CSBGA (10×10) package supports high-density board layouts for space-constrained applications.
• Extended-grade specification: 0 °C to 100 °C operating range suits applications requiring broader commercial temperature tolerance.

Why Choose XC7A15T-L2CPG236E?

The XC7A15T-L2CPG236E balances a practical logic element count, embedded memory and comprehensive I/O in a compact Artix-7 platform from AMD. Its combination of 16,640 logic elements, approximately 0.92 Mbits of RAM and 106 I/Os makes it well suited for designers targeting mid-density programmable solutions that demand integrated memory and flexible interfacing.

With a low-voltage core, extended operating range and a RoHS-compliant 238-LFBGA/CSPBGA surface-mount package, this device provides a scalable, board-friendly option for embedded designs where space, power and integration are key considerations.

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