XC7A15T-3FTG256E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 170 921600 16640 256-LBGA |
|---|---|
| Quantity | 407 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 170 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1300 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 921600 |
Overview of XC7A15T-3FTG256E – Artix-7 Field Programmable Gate Array (256-LBGA)
The XC7A15T-3FTG256E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD in a 256-LBGA package. It provides mid-range programmable logic resources and embedded memory for custom digital designs that require a balance of logic capacity, I/O count, and compact packaging.
This device offers 16,640 logic elements and approximately 0.92 Mbits of embedded memory, 170 I/O pins, a low-voltage core supply range (0.95–1.05 V), and an extended operating temperature range of 0 °C to 100 °C, all in a surface-mount 256-LBGA (256-FTBGA, 17×17) package. RoHS compliance is included.
Key Features
- Core Logic 16,640 logic elements to implement custom digital functions and state machines within a mid-range FPGA fabric.
- Embedded Memory Approximately 0.92 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
- I/O Capacity 170 user I/O pins to interface with peripherals, sensors, and external devices.
- Power Core supply voltage range from 0.95 V to 1.05 V for compatibility with low-voltage power systems.
- Package & Mounting Surface-mount 256-LBGA package (supplier device package: 256-FTBGA, 17×17) for compact board integration.
- Temperature & Grade Extended grade device rated for 0 °C to 100 °C operation.
- Environmental Compliance RoHS compliant for lead-free manufacturing requirements.
Unique Advantages
- Balanced Logic Density: 16,640 logic elements provide ample programmable resources for mid-range digital designs without excessive area or cost.
- On-Chip Memory: Approximately 0.92 Mbits of embedded RAM supports local buffering and data handling to reduce external memory needs.
- Substantial I/O Count: 170 I/O pins enable broad peripheral connectivity and flexible system interfacing.
- Compact, Surface-Mount Package: The 256-LBGA (256-FTBGA, 17×17) footprint supports high-density board layouts and automated assembly.
- Low-Voltage Core Operation: 0.95–1.05 V core supply supports integration into modern low-voltage power architectures.
- Extended Operating Range: Rated for 0 °C to 100 °C operation to suit applications with moderate thermal requirements.
Why Choose XC7A15T-3FTG256E?
The XC7A15T-3FTG256E positions itself as a practical Artix-7 FPGA option where a balance of logic resources, embedded memory, and I/O flexibility is required in a compact surface-mount package. Its combination of 16,640 logic elements, approximately 0.92 Mbits of on-chip RAM, and 170 I/O make it suitable for designs that need moderate programmable capacity with on-board memory and significant interfacing capability.
With a low-voltage core supply and an extended operating temperature range, this device offers a stable, RoHS-compliant solution for applications that demand compact integration and reliable digital implementation over typical commercial temperature conditions.
Request a quote or contact sales to obtain pricing, availability, and lead-time information for the XC7A15T-3FTG256E.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








