XC7A15T-3FGG484E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 250 921600 16640 484-BBGA |
|---|---|
| Quantity | 859 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 250 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1300 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 921600 |
Overview of XC7A15T-3FGG484E – Artix-7 Field Programmable Gate Array (FPGA) 484-BBGA
The XC7A15T-3FGG484E is an AMD Artix-7 Field Programmable Gate Array (FPGA) IC that provides substantial logic, embedded memory, and I/O capacity in a compact BGA package. The device offers approximately 16,640 logic elements, about 0.92 Mbits of on-chip RAM, and support for up to 250 user I/O.
Designed for surface-mount assembly, the device is supplied in a 484-BBGA package (supplier device package listed as 484-FBGA, 23×23) and operates with a core supply range of 950 mV to 1.05 V. It is specified as Extended grade with an operating temperature range of 0°C–100°C and is RoHS compliant.
Key Features
- Core Logic Approximately 16,640 logic elements for implementing custom digital designs and control logic.
- Embedded Memory Approximately 0.92 Mbits of on-chip RAM for buffering, state storage, and small data blocks.
- I/O Capacity Up to 250 user I/O pins to interface with peripherals and external devices.
- Power Core supply voltage range of 950 mV to 1.05 V to match targeted power-rail designs.
- Package & Mounting 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting type for high-density boards.
- Temperature & Grade Extended grade device with an operating temperature range of 0°C to 100°C.
- Environmental Compliance RoHS compliant.
Typical Applications
- I/O-intensive systems Designs requiring up to 250 general-purpose I/O for sensor arrays, peripheral interfaces, or I/O aggregation.
- Custom logic and control Implement specialized digital functions using approximately 16,640 logic elements.
- Embedded memory tasks On-chip buffering and small data storage using approximately 0.92 Mbits of embedded RAM.
Unique Advantages
- Highly integrated logic and memory Combines roughly 16,640 logic elements with ~0.92 Mbits of embedded RAM to consolidate functions that might otherwise require external components.
- Generous I/O capacity Up to 250 I/O simplifies peripheral connectivity and reduces the need for external I/O expanders.
- Compact BGA packaging 484-BBGA / 484-FBGA (23×23) footprint supports high-density board layouts and surface-mount assembly.
- Predictable core supply range Core voltage range of 950 mV–1.05 V enables consistent power planning for the FPGA core.
- Extended operating range Extended grade with 0°C–100°C operation suits temperature-sensitive deployments within that span.
- RoHS compliant Meets RoHS requirements for reduced hazardous substances in assemblies.
Why Choose XC7A15T-3FGG484E?
The XC7A15T-3FGG484E positions AMD Artix-7 FPGA capabilities—moderate logic density, embedded memory, and substantial I/O—into a compact surface-mount BGA package. Its combination of approximately 16,640 logic elements, ~0.92 Mbits of on-chip RAM, and up to 250 I/O makes it suitable for designs that need balanced logic density and connectivity while maintaining a small PCB footprint.
As an Artix-7 family device from AMD, the XC7A15T-3FGG484E offers a clear specification set for engineers and procurement teams seeking a RoHS-compliant, extended-grade FPGA with defined supply and thermal ranges. It is well suited for applications that require reliable on-chip resources and predictable integration into surface-mount assemblies.
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