XC7A15T-2FTG256I

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 921600 16640 256-LBGA

Quantity 14 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1300Number of Logic Elements/Cells16640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits921600

Overview of XC7A15T-2FTG256I – Artix-7 Field Programmable Gate Array (FPGA) IC, 170 I/O, ~0.92 Mbits RAM, 16,640 Logic Elements, 256-LBGA

The XC7A15T-2FTG256I is an Artix-7 series FPGA in a 256-lead LBGA package designed for industrial-grade embedded designs. It provides a balanced combination of programmable logic, embedded memory, and I/O count for implementating custom digital functions within constrained board space and operating environments.

This device is specified for a supply voltage range of 950 mV to 1.05 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require extended temperature capability and surface-mount packaging.

Key Features

  • Programmable Logic Capacity — 16,640 logic elements and 1,300 CLBs provide the resources needed to implement custom state machines, glue logic, and mid-scale digital processing functions.
  • Embedded Memory — Approximately 0.92 Mbits of on-chip RAM for buffering, FIFOs, and small data structures without external memory.
  • Flexible I/O — 170 I/O pins to support multiple parallel interfaces, sensor connections, and peripheral control on a single device.
  • Industrial Temperature Grade — Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
  • Power Supply — Core voltage specified from 950 mV to 1.05 V to align with system power-rail planning.
  • Package and Mounting — 256-LBGA (supplier package: 256-FTBGA, 17 × 17) in a surface-mount form factor for compact PCB layouts.
  • Regulatory Compliance — RoHS compliant for restricted-substance requirements.

Typical Applications

  • Industrial Control — Use the device’s industrial temperature rating and I/O density for sensor interfacing, motor control logic, and factory automation control functions.
  • Embedded Signal Handling — Leverage the on-chip RAM and logic elements for data buffering, simple DSP pipelines, and protocol handling close to sensors or ADCs.
  • I/O Bridging and Protocol Conversion — Implement parallel-to-serial bridges, protocol converters, and glue logic to integrate heterogeneous peripherals within a compact footprint.

Unique Advantages

  • Balanced Logic and Memory: 16,640 logic elements paired with approximately 0.92 Mbits of embedded RAM enable consolidated designs without immediate need for external memory.
  • Ample I/O Count: 170 I/O pins simplify board-level integration by accommodating multiple interfaces and peripheral connections on a single device.
  • Industrial-Grade Operation: Specified for −40 °C to 100 °C to support deployments in demanding temperature environments.
  • Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) allows high-density board layouts while maintaining a standardized package footprint.
  • Controlled Core Supply Range: 950 mV to 1.05 V core supply simplifies power-rail design and compatibility with regulated power sources.
  • RoHS Compliance: Meets restricted-substance requirements for global manufacturing and procurement.

Why Choose XC7A15T-2FTG256I?

The XC7A15T-2FTG256I positions itself as a versatile, industrial-grade Artix-7 FPGA suitable for engineers who need a mid-scale programmable logic device with solid embedded memory and a high I/O count in a compact surface-mount package. Its specified operating temperature range and RoHS compliance make it appropriate for production environments where reliability and regulatory adherence matter.

This device is targeted at designs requiring integrated logic, local memory, and multiple peripheral interfaces—offering a cost-effective way to consolidate discrete logic, interface bridging, and embedded control tasks while maintaining straightforward power and packaging requirements.

Request a quote or submit an inquiry to start a procurement or design conversation about the XC7A15T-2FTG256I and how it can fit your next embedded project.

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