XC7A15T-3CSG324E

The XC7A15T-3CSG324E is an AMD Artix-7 field programmable gate array supplied in a 324-ball CSP/BGA package. It delivers a balance of on-chip logic capacity, embedded memory, and I/O density in a surface-mount package for embedded logic integration.

Key device attributes include 16,640 logic elements, approximately 0.92 Mbits of embedded memory, 210 I/O pins, a 324-ball CSPBGA (15×15) package, low-voltage core operation, and extended-grade temperature capability. These measurable specifications enable straightforward evaluation for board-level designs that require defined logic, memory, and I/O resources.

Key Features

• Core Logic 16,640 logic elements provide the primary programmable fabric for implementing custom digital functions and combinational/sequential logic.
• Embedded Memory Approximately 0.92 Mbits of on-chip RAM for buffering, state storage, and small lookup tables without external memory components.
• I/O Capability 210 user I/O pins to support a wide range of external interfaces and peripherals at the board level.
• Power Core supply specified from 950 mV to 1.05 V to match low-voltage system domains and enable predictable power design.
• Package and Mounting 324-LFBGA / 324-CSPBGA (15×15) surface-mount package suitable for compact PCB footprints and automated assembly.
• Temperature Range Extended grade rating with an operating range of 0 °C to 100 °C for applications that require broader-than-commercial thermal tolerance.
• Compliance RoHS compliant to support regulatory and environmental requirements for lead-free assembly.

Unique Advantages

• Clear logic capacity: 16,640 logic elements give designers a defined resource budget to map custom logic and state machines.
• On-chip memory availability: Approximately 0.92 Mbits of embedded RAM reduces immediate dependence on external memory for small to moderate buffering needs.
• High I/O count: 210 I/O pins enable multiple peripheral connections and flexible board-level interfacing without additional I/O expanders.
• Compact, production-ready package: 324-CSPBGA (15×15) package supports dense PCB integration and surface-mount assembly processes.
• Low-voltage core compatibility: 950 mV to 1.05 V supply requirement aligns with low-voltage system rails for predictable power budgeting.
• Extended operating range: 0 °C to 100 °C grade provides wider operating temperature headroom compared with standard commercial-only ratings.

Why Choose XC7A15T-3CSG324E?

The XC7A15T-3CSG324E positions itself as a measurable, mid-range Artix-7 FPGA option combining defined logic resources, embedded memory, and substantial I/O in a compact 324-ball CSPBGA package. Its low-voltage core and extended operating grade offer practical constraints that simplify power and thermal planning for board-level implementations.

This device is suited to designs where known quantities of logic elements, RAM, and I/O are required and where package density and RoHS compliance are important procurement criteria. Those seeking a clearly specified FPGA for integration into surface-mount assemblies will find the XC7A15T-3CSG324E provides tangible, verifiable attributes to evaluate against system requirements.

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