XC7A15T-3CPG236E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 106 921600 16640 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 669 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 106 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1300 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 921600 |
Overview of XC7A15T-3CPG236E – Artix-7 FPGA, 16,640 Logic Elements, 106 I/Os
The XC7A15T-3CPG236E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 238-pin LFBGA/CSPBGA package. It provides a mid-range programmable fabric suitable for embedded logic, I/O expansion, and custom peripheral integration in compact, surface-mount designs.
With 1,300 configurable logic blocks, 16,640 logic elements and approximately 0.92 Mbits of embedded memory, this device is designed to address applications that require moderate logic density, on-chip memory and a flexible set of I/Os while operating from a low core voltage range.
Key Features
- Core Logic 1,300 configurable logic blocks (CLBs) delivering 16,640 logic elements for implementing custom digital functions and state machines.
- Embedded Memory Approximately 0.92 Mbits of on-chip RAM for buffering, FIFOs and small lookup tables.
- I/O Resources 106 general-purpose I/O pins to support multiple interfaces and peripheral connections directly from the FPGA fabric.
- Power Core supply voltage range from 950 mV to 1.05 V, enabling compatibility with low-voltage power domains.
- Package & Mounting 238-LFBGA, CSPBGA package; supplier device package listed as 238-CSBGA (10×10). Surface-mount package suitable for automated PCB assembly.
- Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for applications within this thermal window.
- Compliance RoHS compliant, meeting environmental requirements for lead-free assembly.
Typical Applications
- Embedded Logic & Control Implement custom control logic, finite state machines and glue logic where moderate gate count and on-chip RAM are required.
- Interface Bridging Translate and aggregate signals between multiple peripherals or bus standards using the available 106 I/Os.
- Prototyping & Development Use as a development platform for validating designs that require reprogrammable logic and in-system updates.
- Signal Processing Perform mid-range digital signal processing tasks that fit within the device’s logic and memory resources.
Unique Advantages
- Balanced logic and memory capacity: 16,640 logic elements paired with approximately 0.92 Mbits of on-chip RAM support a broad range of mid-range digital designs without external SRAM for many use cases.
- Generous I/O count: 106 I/Os allow direct connection to multiple peripherals and interfaces, reducing the need for external I/O expanders.
- Compact surface-mount package: 238-LFBGA/CSPBGA (238-CSBGA 10×10) packaging enables high-density PCB layouts while remaining compatible with standard SMT assembly.
- Low-voltage core operation: Core supply from 0.95 V to 1.05 V supports integration into modern low-voltage power architectures.
- Extended grade reliability: Rated for 0 °C to 100 °C operation to meet designs that require an extended commercial temperature range.
- RoHS compliant: Facilitates lead-free manufacturing and aligns with environmental and regulatory requirements.
Why Choose XC7A15T-3CPG236E?
The XC7A15T-3CPG236E positions itself as a mid-range Artix-7 FPGA option that combines a practical mix of logic density, embedded memory and I/O capability in a compact, surface-mount package. Its low core voltage and extended-grade temperature rating make it suitable for a wide range of embedded and interface-centric designs that require reprogrammability and on-chip resources.
This device is well suited for engineers and teams developing compact systems that need scalable programmable logic, straightforward integration into low-voltage power domains, and compliance with RoHS-based manufacturing processes. The combination of CLBs, logic elements and on-chip RAM delivers flexibility for iterative development and functional consolidation on a single FPGA.
Request a quote or submit an inquiry to receive pricing and availability details for the XC7A15T-3CPG236E. Our team will assist with lead times and ordering information to support your design schedule.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








