XC7A15T-3CPG236E

IC FPGA 106 I/O 238CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 106 921600 16640 238-LFBGA, CSPBGA

Quantity 669 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeExtendedOperating Temperature0°C – 100°C
Package / Case238-LFBGA, CSPBGANumber of I/O106Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1300Number of Logic Elements/Cells16640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits921600

Overview of XC7A15T-3CPG236E – Artix-7 FPGA, 16,640 Logic Elements, 106 I/Os

The XC7A15T-3CPG236E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 238-pin LFBGA/CSPBGA package. It provides a mid-range programmable fabric suitable for embedded logic, I/O expansion, and custom peripheral integration in compact, surface-mount designs.

With 1,300 configurable logic blocks, 16,640 logic elements and approximately 0.92 Mbits of embedded memory, this device is designed to address applications that require moderate logic density, on-chip memory and a flexible set of I/Os while operating from a low core voltage range.

Key Features

  • Core Logic  1,300 configurable logic blocks (CLBs) delivering 16,640 logic elements for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 0.92 Mbits of on-chip RAM for buffering, FIFOs and small lookup tables.
  • I/O Resources  106 general-purpose I/O pins to support multiple interfaces and peripheral connections directly from the FPGA fabric.
  • Power  Core supply voltage range from 950 mV to 1.05 V, enabling compatibility with low-voltage power domains.
  • Package & Mounting  238-LFBGA, CSPBGA package; supplier device package listed as 238-CSBGA (10×10). Surface-mount package suitable for automated PCB assembly.
  • Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications within this thermal window.
  • Compliance  RoHS compliant, meeting environmental requirements for lead-free assembly.

Typical Applications

  • Embedded Logic & Control  Implement custom control logic, finite state machines and glue logic where moderate gate count and on-chip RAM are required.
  • Interface Bridging  Translate and aggregate signals between multiple peripherals or bus standards using the available 106 I/Os.
  • Prototyping & Development  Use as a development platform for validating designs that require reprogrammable logic and in-system updates.
  • Signal Processing  Perform mid-range digital signal processing tasks that fit within the device’s logic and memory resources.

Unique Advantages

  • Balanced logic and memory capacity: 16,640 logic elements paired with approximately 0.92 Mbits of on-chip RAM support a broad range of mid-range digital designs without external SRAM for many use cases.
  • Generous I/O count: 106 I/Os allow direct connection to multiple peripherals and interfaces, reducing the need for external I/O expanders.
  • Compact surface-mount package: 238-LFBGA/CSPBGA (238-CSBGA 10×10) packaging enables high-density PCB layouts while remaining compatible with standard SMT assembly.
  • Low-voltage core operation: Core supply from 0.95 V to 1.05 V supports integration into modern low-voltage power architectures.
  • Extended grade reliability: Rated for 0 °C to 100 °C operation to meet designs that require an extended commercial temperature range.
  • RoHS compliant: Facilitates lead-free manufacturing and aligns with environmental and regulatory requirements.

Why Choose XC7A15T-3CPG236E?

The XC7A15T-3CPG236E positions itself as a mid-range Artix-7 FPGA option that combines a practical mix of logic density, embedded memory and I/O capability in a compact, surface-mount package. Its low core voltage and extended-grade temperature rating make it suitable for a wide range of embedded and interface-centric designs that require reprogrammability and on-chip resources.

This device is well suited for engineers and teams developing compact systems that need scalable programmable logic, straightforward integration into low-voltage power domains, and compliance with RoHS-based manufacturing processes. The combination of CLBs, logic elements and on-chip RAM delivers flexibility for iterative development and functional consolidation on a single FPGA.

Request a quote or submit an inquiry to receive pricing and availability details for the XC7A15T-3CPG236E. Our team will assist with lead times and ordering information to support your design schedule.

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