XC7A15T-L2CSG324E

The XC7A15T-L2CSG324E is an Artix‑7 field programmable gate array (FPGA) IC from AMD. It provides mid‑range programmable logic capacity with on‑chip embedded memory and a substantial I/O count in a compact 324‑LFBGA (324‑CSPBGA, 15×15) surface‑mount package. This device is targeted at designs that require configurable digital logic, embedded RAM, and a high number of I/O signals within a single chip.

Key Features

• Logic Capacity – 1,300 CLBs with 16,640 logic elements (cells) to implement custom digital functions and finite state machines.
• Embedded Memory – Approximately 0.92 Mbits of on‑chip RAM (921,600 total RAM bits) for buffers, FIFOs, and small data storage.
• I/O Density – 210 user I/O pins to support a wide range of external interfaces and parallel connections.
• Package & Mounting – 324‑LFBGA (supplier package: 324‑CSPBGA, 15×15) in a surface‑mount form factor for compact board integration.
• Power – Core voltage supply range specified from 950 mV to 1.05 V to match system power rails.
• Temperature & Grade – Extended grade device with an operating temperature range of 0°C to 100°C.
• Compliance – RoHS compliant, supporting regulatory requirements for lead‑free assembly.

Typical Applications

• Programmable Logic and Prototyping – Implement custom digital logic, algorithm testing, and hardware prototyping where reconfigurable logic is needed.
• I/O Expansion and Interface Bridging – Use the 210 I/O pins to bridge or aggregate multiple peripheral interfaces and perform protocol translation.
• Embedded Memory‑Assisted Designs – Leverage approximately 0.92 Mbits of on‑chip RAM for buffering, small lookup tables, and temporary data storage within signal processing or control paths.

Unique Advantages

• Balanced Logic and Memory: 16,640 logic elements paired with approximately 0.92 Mbits of embedded RAM enables versatile mid‑range designs without external memory for many use cases.
• High I/O Count: 210 I/O pins provide flexibility for connecting sensors, peripherals, buses, and custom interface circuitry.
• Compact Surface‑Mount Package: 324‑LFBGA (324‑CSPBGA, 15×15) minimizes PCB footprint while providing necessary pin density for complex designs.
• Controlled Power Envelope: Core voltage specified between 950 mV and 1.05 V to align with modern low‑voltage system designs.
• Extended Grade Operation: Rated for 0°C to 100°C operation to suit applications requiring extended temperature range performance.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing and global environmental requirements.

Why Choose XC7A15T-L2CSG324E?

The XC7A15T-L2CSG324E positions itself as a mid‑range Artix‑7 FPGA option that combines a meaningful logic element count, embedded RAM capacity, and a high I/O complement in a compact 324‑LFBGA package. Its extended grade temperature range and RoHS compliance make it suitable for a variety of commercial and industrial applications that require reliable, reconfigurable logic and on‑chip memory.

This device is appropriate for designers seeking a single‑chip programmable solution to implement custom logic, interface aggregation, and memory‑assisted processing while maintaining a small PCB footprint and defined power requirements.

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