XC7A200T-3FBG676E

The XC7A200T-3FBG676E is an Artix-7 Field Programmable Gate Array provided in a 676-ball FCBGA package. It combines a large programmable logic fabric, substantial on-chip RAM, and a high I/O count for designs that require significant integration of digital logic and interfaces.

Key attributes visible in the device specification include 215,360 logic elements, approximately 13.46 Mbits of embedded memory, support for up to 400 I/O signals, and operation over a 0°C to 100°C temperature range with a 0.95–1.05 V core supply.

Key Features

• Logic Fabric: 16,825 CLBs and 215,360 logic elements provide a high-capacity programmable logic resource for complex digital functions.
• Embedded Memory: Approximately 13.46 Mbits of on-chip RAM to support buffering, state tables, and memory-intensive logic tasks.
• I/O Capacity: Up to 400 I/O pins to accommodate wide bus interfaces, parallel I/O, or multiple serial interfaces.
• Power Supply: Core voltage specified from 950 mV to 1.05 V for the device core domain.
• Package & Mounting: 676-BBGA (FCBGA) package, supplier device package 676-FCBGA (27×27), designed for surface-mount assembly.
• Operating Range: Rated for operation from 0°C to 100°C and supplied in an Extended grade.
• Regulatory Compliance: RoHS compliant.

Typical Applications

• High-density digital logic: Deploy where large amounts of programmable logic are required, leveraging 215,360 logic elements for complex custom processing.
• Memory-centric FPGA functions: Use for applications that need substantial on-chip RAM—approximately 13.46 Mbits—for buffering, lookup tables, or temporary storage.
• I/O aggregation and interfacing: Suitable for designs requiring up to 400 I/O signals to consolidate multiple interfaces or wide parallel connections.

Unique Advantages

• Highly integrated logic and memory: Large logic element count and substantial embedded RAM together reduce the need for external components and simplify system architecture.
• Generous I/O count: 400 available I/Os enable consolidation of multiple peripherals and high-pin-count interfaces without external multiplexing.
• Compact FCBGA package: 676-ball FCBGA (27×27) provides a dense footprint for high-capacity FPGA functionality in space-constrained board designs.
• Extended temperature grade: Rated for 0°C to 100°C to meet a wide range of commercial and extended-environment applications.
• Low-voltage core operation: Core supply range of 0.95–1.05 V supports modern low-voltage system designs.
• RoHS compliant: Complies with RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose XC7A200T-3FBG676E?

The XC7A200T-3FBG676E positions itself as a high-capacity Artix-7 FPGA option for designs that require abundant programmable logic, significant on-chip RAM, and extensive I/O in a compact FCBGA package. Its combination of 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and up to 400 I/Os makes it suitable for complex digital systems where integration and board-space efficiency matter.

Engineers and procurement teams selecting this device benefit from a clear, specification-driven platform: substantial logic resources, defined operating voltage and temperature ranges, surface-mount packaging, and RoHS compliance—supporting scalable, robust designs that rely on a well-specified FPGA building block.

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