XC7A200T-3FFG1156E

The XC7A200T-3FFG1156E is an Artix-7 Field Programmable Gate Array (FPGA) device by AMD offered in a 1156-ball FCBGA package. It combines substantial logic capacity and embedded RAM with broad I/O count for use in complex digital designs that require on-chip programmable logic and memory.

This surface-mount, extended-grade device operates from 950 mV to 1.05 V and across an operating temperature range of 0 °C to 100 °C, providing a defined electrical and thermal window for system integration.

Key Features

• Logic Capacity — 215,360 logic elements provide extensive programmable logic resources for complex, custom digital designs.
• Configurable Logic Blocks (CLBs) — 16,825 CLBs give structured, scalable logic building blocks across large designs.
• Embedded Memory — Approximately 13.5 Mbits of on-chip RAM for local data buffering, state storage, and intermediate processing.
• I/O Resources — 500 I/O pins to support dense external connectivity and multiple interface requirements.
• Package — 1156-FCBGA (35×35) package case (1156-BBGA, FCBGA) suitable for high-pin-count, surface-mount board designs.
• Power — Core supply range from 950 mV to 1.05 V to match system power planning and regulators.
• Thermal and Grade — Extended-grade device rated for operation from 0 °C to 100 °C for controlled-temperature applications.
• Mounting — Surface mount device for standard PCB assembly processes.
• Compliance — RoHS compliant for environmental and manufacturing consideration.

Typical Applications

• Embedded system prototyping — Use the large logic and memory resources to implement and validate custom digital architectures and firmwares.
• High-density I/O control — 500 I/O pins enable integration of multiple peripherals, sensors, and interfaces on a single FPGA-driven board.
• Custom logic acceleration — Implement application-specific datapaths and accelerators using the extensive CLB and logic element resources.

Unique Advantages

• High logic integration: 215,360 logic elements reduce the need for multiple discrete devices by consolidating complex logic functions on-chip.
• Substantial on-chip memory: Approximately 13.5 Mbits of embedded RAM supports local buffering and reduces external memory dependencies.
• Large I/O count: 500 I/Os simplify board-level routing for systems that require many external connections.
• Compact, high-pin package: The 1156-FCBGA (35×35) package enables high-density designs while maintaining surface-mount assembly compatibility.
• Defined electrical and thermal limits: Clear supply range (950 mV–1.05 V) and operating temperature (0 °C–100 °C) support predictable system integration and thermal planning.
• RoHS compliant: Facilitates environmentally conscious manufacturing and procurement.

Why Choose XC7A200T-3FFG1156E?

The XC7A200T-3FFG1156E positions itself as a high-capacity Artix-7 FPGA option for designs that demand extensive programmable logic, generous embedded memory, and substantial I/O capability in a single surface-mount package. Its extended-grade rating and defined supply/temperature ranges make it suitable for engineered systems that require predictable operating envelopes.

This device is a fit for development teams and production projects seeking to consolidate logic, memory, and interface functions into a single programmable device while leveraging AMD’s Artix-7 family support and RoHS compliance.

Request a quote or submit a sales inquiry to obtain pricing, availability, and lead-time information for the XC7A200T-3FFG1156E.