XC7A200T-L1FB676I

The XC7A200T-L1FB676I is an Artix-7 field programmable gate array (FPGA) IC from AMD supplied in a 676-ball FCBGA package. It provides a large logic fabric and on-chip embedded memory suitable for designs requiring substantial programmable logic and I/O count.

Targeted at industrial applications, the device combines 215,360 logic elements, approximately 13.46 Mbits of embedded memory, and 400 I/Os in a surface-mount 676-FCBGA (27×27) package, operating over a wide temperature range and a core voltage window of 0.95 V to 1.05 V.

Key Features

• Logic Capacity — 215,360 logic elements provide a large programmable fabric for complex digital designs.
• Configurable Logic Blocks — 16,825 CLBs (as specified) to implement user logic and datapaths.
• Embedded Memory — Approximately 13.46 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 400 general-purpose I/Os to support high-pin-count interfaces and extensive external connectivity.
• Power and Core Supply — Core voltage range from 0.95 V to 1.05 V to match system power-rail requirements.
• Package and Mounting — 676-ball FCBGA (676-BBGA) in a 27×27 mm form factor with surface-mount assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial Control — The industrial-grade temperature range (−40 °C to 100 °C) and abundant I/Os make this FPGA well suited for factory automation, motor control, and I/O-rich control systems.
• High-Density I/O Systems — With 400 I/Os, the device supports complex interface aggregation, protocol bridging, and board-level connectivity tasks.
• Memory-Intensive Logic — Approximately 13.46 Mbits of embedded memory enables local buffering, data staging, and packet or stream handling in communications or signal-processing functions.

Unique Advantages

• Large Logic Resource: 215,360 logic elements allow integration of substantial digital functionality into a single device, reducing component count.
• High I/O Count: 400 I/Os simplify designs that require many external interfaces, minimizing the need for external I/O expanders.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, enabling deployment in temperature-challenging industrial environments.
• Compact BGA Packaging: 676-FCBGA (27×27) delivers high density in a surface-mount form factor suitable for modern PCB layouts.
• On-Chip Memory: Approximately 13.46 Mbits of embedded RAM supports buffering and local data processing without external memory for many use cases.
• RoHS Compliant: Conforms to environmental requirements for lead-free assembly and global manufacturing.

Why Choose XC7A200T-L1FB676I?

The XC7A200T-L1FB676I positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant logic density, abundant I/Os, and on-chip memory in a compact FCBGA package. Its specified operating temperature range and RoHS compliance make it appropriate for long-life industrial applications where environmental resilience and regulatory conformity matter.

Engineers and procurement teams can rely on the combination of 215,360 logic elements, extensive embedded memory, and 400 I/Os to consolidate functionality, reduce bill of materials, and simplify board-level integration while meeting industrial operating requirements.

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