XC7A200T-L1FB484I

The XC7A200T-L1FB484I is an Artix-7 field programmable gate array (FPGA) from AMD, supplied in a 484‑ball FCBGA package. It delivers a high density of reconfigurable logic—215,360 logic elements—combined with substantial on‑chip RAM, 285 I/O pins, and industrial temperature capability.

Designed for engineers who need high-density programmable logic in a surface-mount, industrial-grade package, this device supports designs that require a large amount of embedded memory and flexible I/O in a compact 23×23 484‑FCBGA footprint.

Key Features

• Logic Capacity  215,360 logic elements provide substantial reconfigurable logic resources for complex digital functions.
• Embedded Memory  Approximately 13.46 Mbits of embedded memory (13,455,360 bits) to store buffers, lookup tables, and on‑chip data structures.
• I/O  285 user I/O pins to support wide external connectivity and multiple parallel interfaces.
• Power  Core voltage supply range from 950 mV to 1.05 V for the device core power domain.
• Package & Mounting  484‑BBGA (484‑FCBGA) package in a 23×23 mm footprint with surface-mount mounting for compact PCB integration.
• Temperature & Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Control  Implement custom control logic and real‑time processing leveraging the device's high logic capacity and industrial temperature range.
• High‑Density Digital Systems  Use the large logic element count and abundant embedded memory for complex state machines, protocol handling, and parallel processing tasks.
• Interface Aggregation  Aggregate and manage multiple I/O streams using the 285 available I/O pins to connect sensors, peripherals, and external modules.

Unique Advantages

• High Logic Density: 215,360 logic elements enable integration of large, complex digital functions on a single device, reducing board-level component count.
• Significant On‑Chip Memory: Approximately 13.46 Mbits of embedded memory supports buffering, lookup tables, and local data storage without external RAM.
• Robust I/O Count: 285 I/O pins allow flexible connectivity and support for multiple parallel interfaces, simplifying system design.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact, Surface‑Mount Package: 484‑FCBGA (23×23 mm) package offers a compact footprint for space-constrained PCBs while maintaining high resource density.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product development.

Why Choose XC7A200T-L1FB484I?

The XC7A200T-L1FB484I combines a high concentration of logic elements and substantial on‑chip memory in an industrial-grade, surface‑mount 484‑FCBGA package. Its robust I/O count and wide operating temperature range make it suitable for designs that require dense programmable logic and reliable operation across harsh environments.

This device is well suited for engineering teams building complex digital systems where integration density, embedded memory, and industrial reliability are priorities. Its specification set supports scalable designs and long-term deployment in industrial applications.

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