XC7A200T-L2FBG676E

The XC7A200T-L2FBG676E is an Artix-7 field programmable gate array (FPGA) IC from AMD, offering high-density programmable logic and embedded memory in a compact FCBGA package. It provides a combination of large logic capacity, substantial on-chip RAM, and a high I/O count for complex digital designs.

This device is supplied in a 676-FCBGA (27×27) surface-mount package, operates from a 0.95 V to 1.05 V core supply, and is specified for an operating temperature range of 0 °C to 100 °C with an extended grade.

Key Features

• Logic Resources  Provides 215,360 logic elements and 16,825 logic blocks to implement complex custom logic and state machines.
• Embedded Memory  Approximately 13.46 Mbits of on-chip RAM to support packet buffering, data queues, and local storage for processing tasks.
• I/O Capacity  400 general-purpose I/Os for high-density interfacing to peripherals, transceivers, sensors, and high-pin-count connectors.
• Power  Core voltage supply range from 950 mV to 1.05 V to match system power rails and power-management strategies.
• Package & Mounting  676-BBGA / 676-FCBGA (27×27) surface-mount package for space-efficient board layouts and high pin-count routing.
• Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital processing  Use the device’s 215,360 logic elements and embedded RAM to implement application-specific processing pipelines and acceleration functions.
• I/O-intensive interface hubs  With 400 I/Os, implement protocol bridging, signal aggregation, and multi-channel I/O management on a single chip.
• Embedded logic and buffering  Leverage approximately 13.46 Mbits of on-chip RAM for data buffering, FIFOs, and local storage in streaming or real-time systems.

Unique Advantages

• High logic density: 215,360 logic elements enable large-scale, feature-rich logic implementations without external PLD/FPGA expansion.
• Substantial embedded memory: Approximately 13.46 Mbits of RAM reduces reliance on external memory for many buffering and queueing tasks.
• Generous I/O count: 400 I/Os simplify integration with multiple peripherals and high-pin-count connectors, reducing board-level glue logic.
• Compact FCBGA package: 676-FCBGA (27×27) offers a high-pin solution in a small footprint for space-constrained PCBs.
• Controlled core voltage: 0.95 V–1.05 V core supply supports consistent power delivery and system-level power planning.
• Extended temperature grade: Rated 0 °C to 100 °C to meet thermal needs for a wide range of commercial and industrial applications.

Why Choose XC7A200T-L2FBG676E?

The XC7A200T-L2FBG676E combines a high count of logic elements, substantial on-chip RAM, and a large I/O complement in a compact 676-FCBGA package, making it well suited for complex programmable logic tasks where integration density and local memory matter. As an Artix-7 device from AMD, it provides a platform for designers who need scalable logic resources and robust on-chip storage within a surface-mount form factor.

This part is appropriate for teams building high-density, I/O-rich systems that require significant embedded memory and logic capacity, offering design scalability and a straightforward BOM by consolidating functions onto a single FPGA device.

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