XC7A200T-L2FBV484E

The XC7A200T-L2FBV484E is an Artix‑7 field programmable gate array (FPGA) from AMD designed for high-density programmable logic and embedded memory. It combines a large number of logic elements and on-chip RAM with a 484-pin FCBGA package and a moderate operating voltage range to support complex digital designs requiring substantial logic capacity and I/O.

Key Features

• Logic Capacity — 215,360 logic elements and 16,825 configurable logic blocks (CLBs) provide substantial programmable logic resources for complex designs and system integration.
• Embedded Memory — Approximately 13.46 Mbits of on-chip RAM for buffering, local data storage, and intermediate processing without external memory.
• I/O Density — 285 user I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-end connections.
• Power Supply — Operates within a core supply range of 950 mV to 1.05 V, enabling predictable power planning for system-level designs.
• Package & Mounting — 484-FCBGA (23×23) / 484-BBGA package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C for temperature-tolerant deployments.
• Regulatory Compliance — RoHS compliant, supporting restrictions on hazardous substances for regulatory and environmental requirements.

Typical Applications

• High-density digital processing — Use the large logic cell count and on-chip RAM for compute-intensive custom logic, data-path acceleration, or pipeline-heavy designs.
• Data acquisition and aggregation — 285 I/Os and substantial embedded memory make the device suitable for collecting, buffering, and pre-processing sensor or data stream inputs.
• Prototype and system integration — The combination of abundant logic, RAM, and I/O is well suited to hardware prototyping, platform development, and integration of multiple subsystems on a single FPGA.
• Hardware acceleration — Leverage the FPGA’s logic and memory resources to implement custom accelerators and application-specific processing blocks.

Unique Advantages

• High logic density: 215,360 logic elements and 16,825 CLBs enable complex designs without immediate partitioning across multiple devices.
• Significant on-chip memory: Approximately 13.46 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• Ample I/O count: 285 I/Os give designers flexibility to connect multiple peripherals, interfaces, and parallel data busses directly to the FPGA.
• Compact surface-mount package: 484-FCBGA (23×23) / 484-BBGA offers a space-efficient footprint for board-level integration where board area is constrained.
• Extended operating range: Rated for 0 °C to 100 °C and RoHS compliant, supporting temperature-tolerant deployments and regulatory requirements.

Why Choose XC7A200T-L2FBV484E?

The XC7A200T-L2FBV484E positions itself as a high-capacity FPGA option for designs that require abundant logic resources, significant embedded memory, and a large number of I/Os in a compact surface-mount package. Its extended-grade rating and core supply window make it suitable for a wide range of board- and system-level applications where on-chip resources and I/O flexibility drive design decisions.

This part is well suited for engineers and system architects building complex digital systems, prototypes, or hardware accelerators that benefit from consolidated logic and memory resources in a single FPGA device.

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