XC7A200T-L2FBV676E4322

The XC7A200T-L2FBV676E4322 is an Artix‑7 field programmable gate array (FPGA) IC from AMD designed for high-density logic integration. It combines a large logic fabric with embedded memory and a substantial I/O count in a compact 676‑ball FCBGA package for surface-mount assembly.

This device is targeted at designs requiring significant programmable logic resources and on-chip memory within an extended-grade temperature range, offering a balance of integration and predictable electrical characteristics for embedded and system-level applications.

Key Features

• Logic Capacity – Provides 215,360 logic elements and 16,825 CLBs to implement complex digital logic and state machines.
• Embedded Memory – Approximately 13.46 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources – 400 user I/O pins to support multiple parallel interfaces and external device connectivity.
• Power Requirements – Core supply range specified from 920 mV to 980 mV for system power planning and regulator selection.
• Package & Mounting – 676‑FCBGA (27×27) surface-mount package suitable for compact PCB layouts and high-density board integration.
• Temperature & Grade – Extended grade device with an operating temperature range of 0 °C to 100 °C to meet a variety of environmental conditions.
• Compliance – RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• High‑density logic implementations – Use the large logic capacity for complex glue logic, protocol bridging, and custom compute pipelines.
• On‑chip buffering and memory functions – Leverage approximately 13.46 Mbits of embedded RAM for packet buffering, FIFOs, and local data storage.
• Multi‑interface systems – Deploy the 400 I/O pins for parallel interfaces, sensor clusters, and multiple high-pin-count peripherals.
• Compact board designs – Utilize the 676‑FCBGA package for space-constrained PCBs that require surface-mount assembly.

Unique Advantages

• High logic density: 215,360 logic elements enable consolidation of multiple functions into a single device, reducing BOM and interconnect complexity.
• Substantial on‑chip memory: Approximately 13.46 Mbits of embedded RAM supports local buffering and reduces external memory dependence.
• Generous I/O count: 400 user I/O pins provide design flexibility for complex interfacing and parallel signal routing.
• Compact, industry-standard package: The 676‑FCBGA (27×27) surface-mount package balances density and manufacturability for production assemblies.
• Extended operating range: Extended grade with 0 °C to 100 °C operation supports a wide set of environment conditions without overspecification.
• Controlled core supply window: Specified 920 mV to 980 mV supply range aids power budgeting and regulator selection for stable operation.

Why Choose XC7A200T-L2FBV676E4322?

The XC7A200T-L2FBV676E4322 delivers a combination of high logic capacity, meaningful embedded memory, and broad I/O resources in a compact FCBGA package—positioning it for applications that require substantial programmable resources while maintaining a compact PCB footprint. Its extended-grade temperature range and defined supply window simplify hardware validation for a wide range of embedded designs.

As an AMD Artix‑7 device, it provides the raw on-chip resources needed to consolidate functions, reduce external components, and streamline system architecture for customers focused on scalable and maintainable FPGA-based designs.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the XC7A200T-L2FBV676E4322.