XC7A200T-L2FFV1156E4322

The XC7A200T-L2FFV1156E4322 is an Artix-7 field programmable gate array supplied in a 1156-ball FCBGA package. It provides a large on-chip logic capacity and high I/O count for complex, reconfigurable digital designs. Targeted at applications that require extensive programmable logic, substantial embedded memory, and flexible I/O in a surface-mount package, this device delivers integration and deployment flexibility.

Key Features

• Core Logic  Provides 215,360 logic elements for implementing complex custom logic and parallel processing architectures.
• Configurable Logic Blocks  Contains 16,825 configurable logic blocks (CLBs) to structure and allocate the device’s logic resources.
• Embedded Memory  Approximately 13.45 Mbits of on-chip RAM to support data buffering, frame storage, and state machines without external memory.
• I/O Capacity  Up to 500 general-purpose I/O pins to interface with multiple peripherals, buses, sensors, and transceivers.
• Power Supply  Operates from a core voltage range of 0.950 V to 1.05 V, allowing precise power provisioning for the core.
• Package & Mounting  1156-FCBGA (35 × 35 mm) package in a surface-mount form factor for compact board integration.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for a variety of commercial and extended-environment applications.
• Compliance  RoHS compliant, supporting lead-free assembly and environmental regulatory needs.

Typical Applications

• High-density digital systems  Use the large logic element count and CLB structure to implement complex state machines, custom processors, and parallel compute blocks.
• Embedded memory-intensive designs  Leverage approximately 13.45 Mbits of on-chip RAM for frame buffering, packet queuing, and intermediate data storage without immediate external memory.
• Multi-interface platforms  Deploy the 500 I/O pins to connect to multiple sensors, buses, and peripherals in communication, instrumentation, and control systems.
• Compact board-level integration  The 1156-FCBGA (35×35) surface-mount package enables high-density PCB layouts where board space and I/O count are priorities.

Unique Advantages

• Large logic capacity: 215,360 logic elements enable substantial on-chip implementation of custom logic and parallel datapaths, reducing reliance on external processors.
• Significant embedded memory: Approximately 13.45 Mbits of RAM supports local buffering and state retention, simplifying system memory architecture.
• High I/O count: 500 I/O pins provide flexibility to connect multiple external devices and interfaces without multiplexing compromises.
• Compact, industry-standard package: 1156-FCBGA (35×35) allows dense PCB integration while maintaining a large number of I/Os and core resources.
• Extended operating grade: Rated for 0 °C to 100 °C operation, suitable for designs requiring broader-than-standard commercial temperature range.
• RoHS compliant: Facilitates lead-free assembly and aligns with environmental compliance requirements.

Why Choose XC7A200T-L2FFV1156E4322?

The XC7A200T-L2FFV1156E4322 combines a high count of logic elements, substantial embedded RAM, and 500 I/O in a compact 1156-FCBGA surface-mount package. Its extended-grade temperature range and RoHS compliance make it suitable for demanding commercial and extended-environment applications that need significant on-chip resources and flexible interfacing.

This part is well suited for engineering teams designing scalable, reconfigurable systems that require on-board memory, dense I/O, and a large programmable fabric. Its combination of capacity, package density, and electrical envelope supports long-term design scalability and integration into space-constrained boards.

Request a quote or submit an inquiry to receive pricing and availability for the XC7A200T-L2FFV1156E4322 and to discuss how it fits your next design.