XCS20-3PQ208I

The XCS20-3PQ208I is a Spartan® field programmable gate array (FPGA) IC in a 208-BFQFP surface-mount package. It integrates 950 logic elements, approximately 12.8 kbits of embedded memory, and 160 user I/O, making it suited for designs that require reconfigurable logic in an industrial-temperature environment.

Designed for 5 V systems, the device operates from 4.5 V to 5.5 V and is specified for an operating temperature range of -40 °C to 100 °C, supporting deployment in industrial-grade applications that require robust thermal performance.

Key Features

• Logic Capacity  950 logic elements provide resources for implementing customized combinational and sequential logic functions within a compact FPGA footprint.
• Embedded Memory  Approximately 12.8 kbits of on-chip RAM to support small data buffers, state storage, and local scratch memory.
• General-Purpose I/O  160 user I/O pins support a wide variety of external interfaces and signal connections for system integration.
• Gate Count  20,000 gates for representing overall device complexity and integration density.
• Power Supply  Operates from 4.5 V to 5.5 V, compatible with standard 5 V digital power domains.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor to suit PCB assembly processes and compact board layouts.
• Industrial Temperature Range  Specified for operation from -40 °C to 100 °C, enabling use in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control  Use where industrial temperature ratings and 160 I/O are needed to interface with sensors, actuators, and control peripherals while implementing custom logic with 950 logic elements.
• Embedded I/O and protocol bridging  Implement protocol translation, parallel/serial interface logic, or glue logic using the device’s 160 I/O and on-chip memory for buffering.
• Low- to mid-density logic integration  Integrate discrete logic functions and moderate combinational/sequential designs within a single FPGA footprint using 20,000 gates of capacity and 950 logic elements.

Unique Advantages

• Industrial-grade thermal capability: The −40 °C to 100 °C operating range supports deployment in demanding environments where extended temperature tolerance is required.
• 5 V supply compatibility: A 4.5 V to 5.5 V supply range simplifies integration into existing 5 V digital systems without additional level translation for power.
• High I/O count in a compact package: 160 user I/O in a 208-BFQFP package provides extensive connectivity while maintaining a manageable PCB footprint.
• Balanced logic and memory resources: 950 logic elements combined with approximately 12.8 kbits of embedded RAM enable implementation of control, interfacing, and buffering functions within a single device.
• Surface-mount packaging: The 208-PQFP (28 × 28 mm) supplier package supports automated PCB assembly for production volumes.

Why Choose XCS20-3PQ208I?

The XCS20-3PQ208I delivers a balanced combination of logic capacity, I/O density, and industrial temperature capability for designs that need reconfigurable logic and robust environmental performance. Its 950 logic elements, approximately 12.8 kbits of embedded memory, and 160 I/O make it suitable for control, interface, and moderate-complexity integration tasks in industrial-grade systems.

This device is a practical option for engineers and buyers seeking a Spartan® FPGA in a surface-mount 208-BFQFP package with 5 V supply compatibility and RoHS compliance, offering predictable integration characteristics for volume production and long-term deployments.

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