XCS40XL-4BG256C

The XCS40XL-4BG256C is a Spartan®-XL Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded logic applications. It integrates 1,862 logic elements, 25,088 bits of on-chip RAM, and up to 205 I/O pins in a 256-ball BGA/PBGA package to support mid-density programmable logic needs within a 3.0 V–3.6 V supply range.

With a 0 °C to 85 °C operating range and surface-mount packaging, this device targets designs that require a compact, reconfigurable silicon element with a balance of logic, memory, and I/O resources.

Key Features

• Core Logic 1,862 logic elements provide flexible, reprogrammable logic capacity for custom digital functions.
• On-chip Memory 25,088 bits of embedded RAM (approximately 0.025 Mbits) for local data buffering, state storage, and small FIFOs.
• I/O Density Up to 205 user I/O pins to interface with external devices, sensors, and buses.
• Gate Equivalence Approximately 40,000 equivalent gates to help size projects and partition logic resources.
• Power Operates from a 3.0 V to 3.6 V supply range suitable for common digital power domains.
• Package & Mounting 256-ball BGA (Package Case: 256-BBGA) with supplier device package listed as 256-PBGA (27×27); surface-mount mounting simplifies PCB assembly in compact layouts.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded Control — Implement custom control logic and finite-state machines using the device’s 1,862 logic elements and on-chip RAM for local state and buffering.
• I/O Expansion — Use up to 205 I/O pins to expand digital interfacing for sensors, communication transceivers, or peripheral devices.
• Prototyping and Development — Rapidly validate and iterate digital designs that require reprogrammable logic and modest embedded memory.

Unique Advantages

• Balanced Logic-to-Memory Ratio: The combination of 1,862 logic elements and 25,088 bits of RAM supports designs that need both combinational/sequential logic and local data storage.
• High I/O Count: With 205 available I/O pins, the device enables direct interfacing to a wide range of external components without extensive external glue logic.
• Compact Surface-Mount Package: The 256-ball PBGA/BGA package allows dense PCB placement and supports automated assembly processes.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployments in standard commercial environments.
• Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing and product compliance goals.

Why Choose XCS40XL-4BG256C?

The XCS40XL-4BG256C offers a practical combination of logic resources, embedded memory, and I/O capacity in a compact surface-mount package, making it suited for mid-density programmable logic tasks in commercial electronics. Its supply voltage range and commercial temperature rating align with many standard embedded system power and thermal profiles.

This device is a viable option for engineers and procurement teams seeking a reprogrammable component that provides clear, verifiable hardware resources—logic elements, on-chip RAM, gate equivalence, and I/O count—backed by RoHS compliance and conventional package options for streamlined board integration.

Request a quote or submit a pricing inquiry to obtain availability, lead times, and volume pricing for the XCS40XL-4BG256C.