AS4C16M16S-6BIN
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 1,645 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B2A | HTS Code | 8542.32.0024 |
Overview of AS4C16M16S-6BIN - 256Mbit SDRAM Memory
The AS4C16M16S-6BIN is a 256-megabit synchronous dynamic random-access memory (SDRAM) designed for embedded systems requiring cost-effective, high-density volatile memory. Organized as 16M x 16, this parallel interface SDRAM operates at 166MHz and supports 3V to 3.6V supply voltage, making it suitable for industrial and commercial applications where reliable data buffering and temporary storage are essential.
Key Features
- Memory Architecture - 256Mbit capacity with 16M x 16 organization provides efficient word-width access for 16-bit data bus systems.
- Performance - 166MHz clock frequency with 5.4ns access time delivers responsive data throughput for real-time processing applications.
- Power Supply - 3V to 3.6V operating voltage aligns with standard embedded system power rails, simplifying board design integration.
- Temperature Range - Industrial-grade -40°C to 85°C operating temperature supports deployment in environmentally challenging conditions.
- Package - Compact 54-TFBGA (8x8mm) footprint minimizes PCB real estate requirements while maintaining robust solder joint reliability.
- Interface - Parallel memory interface offers straightforward integration with microcontrollers and processors using conventional SDRAM timing protocols.
Typical Applications
- Industrial Control Systems - This SDRAM serves as working memory for PLCs and SCADA systems where extended temperature tolerance ensures stable operation in factory floor environments.
- Communications Equipment - Provides buffering for routers and switches handling packet data, where the 166MHz clock frequency supports moderate bandwidth requirements.
- Embedded Computing - Acts as main memory for single-board computers and embedded processors in applications requiring volatile storage for program execution and data manipulation.
- Test and Measurement - Offers temporary data storage for oscilloscopes and logic analyzers where the parallel interface simplifies integration with existing architectures.
Unique Advantages
- Proven SDRAM Technology: Mature synchronous DRAM architecture reduces design risk and leverages well-established software drivers and timing controllers.
- Industrial Temperature Performance: -40°C to 85°C operation extends deployment range beyond consumer-grade components, improving system reliability in harsh environments.
- Compact BGA Footprint: 8x8mm package size reduces board space consumption compared to larger memory modules, enabling more compact product designs.
- Standard Voltage Operation: 3.3V nominal supply voltage eliminates the need for additional voltage regulators in systems already supporting this rail.
- Parallel Interface Simplicity: Direct memory access without complex protocol overhead simplifies firmware development and debugging for embedded teams.
- Cost-Effective Density: 256Mbit capacity provides sufficient memory for many embedded applications without overprovisioning, optimizing bill-of-materials costs.
Why Choose AS4C16M16S-6BIN?
This SDRAM is positioned for embedded designs requiring proven memory technology with industrial temperature capability. The 16M x 16 organization and parallel interface make it particularly suitable for legacy system upgrades or new designs where SDRAM timing controllers are already implemented. Engineering teams benefit from the straightforward integration path and the component's ability to operate reliably across the industrial temperature range.
While this product carries an obsolete lifecycle status, it remains valuable for maintenance, repair, and sustaining engineering applications where design continuity is essential. The combination of standard SDRAM functionality, industrial-grade temperature tolerance, and compact BGA packaging addresses the specific needs of embedded systems requiring dependable volatile memory.
Get Started with AS4C16M16S-6BIN
Contact our technical sales team to discuss availability, pricing, and application support for the AS4C16M16S-6BIN. Our engineers can assist with integration guidance, timing analysis, and sourcing options to meet your project requirements.