AS4C16M16S-6BINTR

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 1,940 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C16M16S-6BINTR - 256Mbit Synchronous DRAM

The AS4C16M16S-6BINTR from Alliance Memory is a 256-megabit synchronous dynamic random-access memory (SDRAM) organized as 16M x 16. This parallel-interface DRAM operates at up to 166 MHz clock frequency with a 5.4 ns access time, making it well-suited for embedded systems requiring high-speed volatile memory. The device operates from a 3V to 3.6V supply and is packaged in a compact 54-pin TFBGA (8x8mm) footprint.

Key Features

  • Memory Configuration - 256 megabits organized as 16M x 16 provides flexible word-width access for 16-bit data bus architectures commonly found in embedded processors and microcontrollers.
  • Performance Specifications - 166 MHz clock frequency with 5.4 ns access time and 12 ns write cycle time delivers responsive memory performance for real-time applications.
  • Power Supply - Single 3.0V to 3.6V supply voltage simplifies power management and aligns with standard 3.3V logic levels used in most embedded designs.
  • Operating Temperature Range - -40°C to 85°C industrial temperature range ensures reliable operation in challenging thermal environments beyond consumer-grade specifications.
  • Package - Compact 54-pin TFBGA in an 8x8mm footprint minimizes board space requirements for space-constrained designs.
  • Parallel Interface - Standard parallel memory interface provides straightforward integration with processors and controllers supporting external SDRAM.

Typical Applications

  • Industrial Control Systems - This SDRAM provides working memory for programmable logic controllers (PLCs) and industrial computers where the extended temperature range supports operation in factory floor environments with varying thermal conditions.
  • Embedded Computing - Serves as main system memory or frame buffer in embedded processors and single-board computers that require moderate-density volatile storage with parallel bus compatibility.
  • Networking Equipment - Functions as packet buffer or lookup table memory in routers, switches, and network interface cards where 166 MHz operation supports wire-speed packet processing requirements.
  • Instrumentation and Test Equipment - Provides data acquisition buffering and waveform storage in measurement instruments where industrial temperature tolerance ensures consistent performance across laboratory and field deployment scenarios.

Unique Advantages

  • Industrial Temperature Tolerance: -40°C to 85°C range extends deployment options beyond commercial-grade components, reducing need for thermal management in moderately harsh environments.
  • Compact Ball Grid Array Package: 8x8mm TFBGA footprint conserves PCB area compared to larger packages, enabling denser board layouts in size-constrained products.
  • Standard Parallel Interface: Direct processor bus compatibility eliminates the need for interface conversion logic, simplifying design and reducing component count.
  • Proven SDRAM Technology: Mature synchronous DRAM architecture offers predictable timing characteristics and broad ecosystem support including reference designs and driver software.
  • Flexible Organization: 16M x 16 word structure matches common embedded processor data bus widths, minimizing read-modify-write cycles for improved efficiency.

Why Choose AS4C16M16S-6BINTR?

The AS4C16M16S-6BINTR offers a practical solution for embedded systems requiring moderate-density volatile memory with industrial temperature capability. Its 256-megabit capacity and 16-bit organization align well with mid-range embedded processors in industrial control, networking, and instrumentation applications. The compact TFBGA package and standard parallel interface facilitate integration into space-constrained designs while maintaining compatibility with established processor architectures.

This component is particularly well-suited for designs targeting industrial or commercial environments where extended temperature tolerance is required but automotive-grade qualification is not necessary. The 166 MHz clock support provides adequate performance for many real-time embedded workloads while the mature SDRAM architecture ensures predictable behavior and broad toolchain support.

Get a Quote

Contact our sales team to discuss pricing and availability for the AS4C16M16S-6BINTR. We can provide technical support for your specific application requirements and help evaluate whether this SDRAM meets your design specifications.

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