AS4C16M16S-6BINTR
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 1,940 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of AS4C16M16S-6BINTR - 256Mbit Synchronous DRAM
The AS4C16M16S-6BINTR from Alliance Memory is a 256-megabit synchronous dynamic random-access memory (SDRAM) organized as 16M x 16. This parallel-interface DRAM operates at up to 166 MHz clock frequency with a 5.4 ns access time, making it well-suited for embedded systems requiring high-speed volatile memory. The device operates from a 3V to 3.6V supply and is packaged in a compact 54-pin TFBGA (8x8mm) footprint.
Key Features
- Memory Configuration - 256 megabits organized as 16M x 16 provides flexible word-width access for 16-bit data bus architectures commonly found in embedded processors and microcontrollers.
- Performance Specifications - 166 MHz clock frequency with 5.4 ns access time and 12 ns write cycle time delivers responsive memory performance for real-time applications.
- Power Supply - Single 3.0V to 3.6V supply voltage simplifies power management and aligns with standard 3.3V logic levels used in most embedded designs.
- Operating Temperature Range - -40°C to 85°C industrial temperature range ensures reliable operation in challenging thermal environments beyond consumer-grade specifications.
- Package - Compact 54-pin TFBGA in an 8x8mm footprint minimizes board space requirements for space-constrained designs.
- Parallel Interface - Standard parallel memory interface provides straightforward integration with processors and controllers supporting external SDRAM.
Typical Applications
- Industrial Control Systems - This SDRAM provides working memory for programmable logic controllers (PLCs) and industrial computers where the extended temperature range supports operation in factory floor environments with varying thermal conditions.
- Embedded Computing - Serves as main system memory or frame buffer in embedded processors and single-board computers that require moderate-density volatile storage with parallel bus compatibility.
- Networking Equipment - Functions as packet buffer or lookup table memory in routers, switches, and network interface cards where 166 MHz operation supports wire-speed packet processing requirements.
- Instrumentation and Test Equipment - Provides data acquisition buffering and waveform storage in measurement instruments where industrial temperature tolerance ensures consistent performance across laboratory and field deployment scenarios.
Unique Advantages
- Industrial Temperature Tolerance: -40°C to 85°C range extends deployment options beyond commercial-grade components, reducing need for thermal management in moderately harsh environments.
- Compact Ball Grid Array Package: 8x8mm TFBGA footprint conserves PCB area compared to larger packages, enabling denser board layouts in size-constrained products.
- Standard Parallel Interface: Direct processor bus compatibility eliminates the need for interface conversion logic, simplifying design and reducing component count.
- Proven SDRAM Technology: Mature synchronous DRAM architecture offers predictable timing characteristics and broad ecosystem support including reference designs and driver software.
- Flexible Organization: 16M x 16 word structure matches common embedded processor data bus widths, minimizing read-modify-write cycles for improved efficiency.
Why Choose AS4C16M16S-6BINTR?
The AS4C16M16S-6BINTR offers a practical solution for embedded systems requiring moderate-density volatile memory with industrial temperature capability. Its 256-megabit capacity and 16-bit organization align well with mid-range embedded processors in industrial control, networking, and instrumentation applications. The compact TFBGA package and standard parallel interface facilitate integration into space-constrained designs while maintaining compatibility with established processor architectures.
This component is particularly well-suited for designs targeting industrial or commercial environments where extended temperature tolerance is required but automotive-grade qualification is not necessary. The 166 MHz clock support provides adequate performance for many real-time embedded workloads while the mature SDRAM architecture ensures predictable behavior and broad toolchain support.
Get a Quote
Contact our sales team to discuss pricing and availability for the AS4C16M16S-6BINTR. We can provide technical support for your specific application requirements and help evaluate whether this SDRAM meets your design specifications.