AS4C16M16S-6TCNTR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 242 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C16M16S-6TCNTR - 256Mbit SDRAM Memory IC

The AS4C16M16S-6TCNTR from Alliance Memory is a 256Mbit synchronous DRAM (SDRAM) organized as 16M x 16, designed for embedded systems and computing applications requiring reliable parallel memory access. With a 166MHz clock frequency and 5.4ns access time, this SDRAM delivers dependable performance for standard commercial temperature applications where cost-effective memory expansion is essential.

Key Features

  • Memory Architecture - 256Mbit capacity with 16M x 16 organization provides flexible data width for 16-bit bus applications
  • Performance Specifications - 166MHz clock frequency with 5.4ns access time and 12ns write cycle time ensures responsive data throughput
  • Power Supply - 3V to 3.6V operating voltage compatible with standard 3.3V logic systems
  • Package Options - 54-pin TSOP II (10.16mm width) surface mount package designed for space-efficient PCB layouts
  • Operating Temperature - Commercial temperature range of 0°C to 70°C (TA) suitable for standard indoor environments

Typical Applications

  • Consumer Electronics - This SDRAM provides cost-effective system memory for set-top boxes, digital displays, and entertainment devices where moderate performance meets budget requirements.
  • Embedded Computing - Serves as main memory or frame buffer in embedded controllers and single-board computers operating in temperature-controlled environments.
  • Networking Equipment - Suitable for packet buffering and data storage in network switches and routers deployed in office or datacenter settings.
  • Test and Measurement - Offers reliable data capture and processing memory for benchtop instrumentation operating within standard laboratory conditions.

Unique Advantages

  • Cost-Optimized Memory Solution: Standard SDRAM technology reduces BOM costs for budget-conscious designs compared to higher-performance DDR alternatives
  • Proven JEDEC-Standard Interface: Parallel SDRAM interface simplifies integration with legacy controllers and reduces firmware development time
  • Established Supply Chain: Alliance Memory specialization in memory products supports consistent availability for production planning
  • Compact Surface Mount Package: TSOP II footprint minimizes board space while supporting automated assembly processes

Why Choose AS4C16M16S-6TCNTR?

The AS4C16M16S-6TCNTR is positioned for designs requiring straightforward, cost-effective parallel memory where newer DDR technologies would be over-specified. It suits commercial-grade applications operating in controlled environments where the 0°C to 70°C temperature range is adequate. Engineers selecting this component benefit from Alliance Memory's focus on memory product continuity and technical support.

Note: This product has an Obsolete lifecycle status. Designers should confirm availability and plan for potential end-of-life transitions or alternative component sourcing for new designs.

Request a Quote

Contact our sales team to discuss availability, pricing, and technical specifications for the AS4C16M16S-6TCNTR. Our application engineers can help determine if this memory solution meets your design requirements and assist with integration support.

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