AS4C16M16S-6TCN

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 1,251 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B2AHTS Code8542.32.0024

Overview of AS4C16M16S-6TCN - 256Mbit Parallel SDRAM

The AS4C16M16S-6TCN from Alliance Memory is a 256Mbit synchronous dynamic RAM (SDRAM) organized as 16M x 16, designed for high-performance computing applications. This parallel SDRAM provides reliable memory storage for embedded systems and industrial equipment requiring fast data access and moderate density. Built on proven SDRAM technology, it delivers consistent performance for applications operating in standard commercial temperature ranges.

Key Features

  • Memory Architecture - 256Mbit SDRAM with 16M x 16 organization provides efficient word-level access for data-intensive applications.
  • High-Speed Operation - 166MHz clock frequency with 5.4ns access time enables rapid data retrieval for time-critical processing tasks.
  • Parallel Interface - Direct parallel memory interface simplifies integration with legacy systems and reduces controller complexity compared to serial memory architectures.
  • Power Supply - Single 3V to 3.6V supply voltage aligns with standard logic levels for straightforward integration into existing designs.
  • Compact Package - 54-pin TSOP II package in standard 10.16mm width offers space-efficient surface mount installation.
  • Commercial Temperature Range - Operates reliably from 0°C to 70°C for applications in controlled environments.

Typical Applications

  • Embedded Computing - This SDRAM provides working memory for microprocessor-based systems where moderate density and fast parallel access support real-time data processing requirements.
  • Industrial Control Systems - Serves as buffer memory in automation controllers and monitoring equipment operating in standard temperature environments, offering reliable performance for data logging and control algorithms.
  • Telecommunications Equipment - Functions as packet buffer memory in networking devices and telecom infrastructure where parallel interface compatibility enables straightforward integration with existing architectures.
  • Consumer Electronics - Supports legacy product lines and replacement applications where established SDRAM technology maintains compatibility with proven designs.

Unique Advantages

  • Proven SDRAM Technology: Leverages well-established synchronous DRAM architecture that reduces design risk and accelerates time-to-market for legacy system updates.
  • Simplified Parallel Interface: Eliminates the need for complex serial protocol controllers, reducing overall BOM cost and simplifying firmware development.
  • Standard Voltage Operation: Single 3.3V nominal supply simplifies power distribution and enables direct interfacing with common logic families without level translation.
  • Fast Access Performance: 5.4ns access time and 166MHz operation support demanding data throughput requirements for real-time processing applications.
  • Space-Efficient Packaging: Industry-standard TSOP II footprint maximizes board density while maintaining manufacturability with conventional SMT assembly processes.

Why Choose AS4C16M16S-6TCN?

The AS4C16M16S-6TCN is positioned for replacement applications and legacy system maintenance where established SDRAM technology provides known reliability and proven compatibility. With its standard parallel interface and commercial temperature rating, this memory IC suits embedded designs operating in controlled environments. Given its obsolete lifecycle status, this component is ideal for sustaining engineering projects, spare parts inventory, and product line extensions requiring drop-in compatibility with existing architectures.

For new designs, consider evaluating current-generation memory solutions that offer improved density, lower power consumption, and extended temperature ratings to maximize long-term product supportability.

Get a Quote

Contact our sales team to discuss pricing, availability, and technical specifications for the AS4C16M16S-6TCN. Our experts can help you determine if this memory solution meets your application requirements or recommend alternative components for optimal performance and long-term availability.

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