AS4C16M16D2-25BINTR

IC DRAM 256MBIT PAR 84TFBGA
Part Description

IC DRAM 256MBIT PAR 84TFBGA

Quantity 879 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package84-TFBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size256 MbitAccess Time400 psGradeAutomotive
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0032

Overview of AS4C16M16D2-25BINTR - 256Mbit DDR2 SDRAM

The AS4C16M16D2-25BINTR is a 256-megabit DDR2 SDRAM memory device from Alliance Memory, Inc., organized as 16M x 16. This parallel-interface volatile memory operates at 400MHz clock frequency with 4ns access time, making it suitable for applications requiring high-speed, cost-effective memory solutions. With an extended temperature range and industry-standard 84-TFBGA packaging, this DDR2 SDRAM delivers reliable performance for embedded systems and industrial applications.

Key Features

  • 256Mbit Density - Organized as 16M x 16 configuration, providing flexible memory addressing for embedded designs.
  • DDR2 SDRAM Technology - Double data rate architecture operating at 400MHz clock frequency with 4ns access time for efficient data throughput.
  • Voltage Supply - Operates on 1.7V to 1.9V supply voltage, supporting low-power design requirements.
  • Extended Temperature Range - Rated for -40°C to 95°C (case temperature), ensuring reliable operation in industrial and automotive environments.
  • 84-TFBGA Package - Compact 8mm x 12.5mm thin fine-pitch ball grid array package minimizes board space while providing robust connections.
  • 15ns Write Cycle Time - Fast write performance supports demanding real-time applications and data buffering requirements.

Typical Applications

  • Industrial Automation Systems - This DDR2 SDRAM provides reliable memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and motion control systems where the extended temperature range ensures consistent operation in factory floor environments.
  • Embedded Computing Platforms - Serves as main system memory or frame buffer in embedded single-board computers and system-on-module designs, offering a balance of capacity, speed, and cost efficiency for resource-constrained applications.
  • Networking Equipment - Provides packet buffering and routing table storage in routers, switches, and network interface cards where the 400MHz operation supports wire-speed processing requirements.
  • Test and Measurement Instruments - Enables data acquisition and signal processing in oscilloscopes, spectrum analyzers, and automated test equipment where the parallel interface facilitates direct integration with FPGAs and DSPs.
  • Medical Devices - Supports real-time data processing and image buffering in diagnostic imaging equipment and patient monitoring systems where reliability across temperature variations is critical.

Unique Advantages

  • Proven DDR2 Technology: Leverages mature, industry-standard DDR2 architecture with broad ecosystem support, reducing design risk and simplifying qualification.
  • Extended Temperature Qualification: -40°C to 95°C case temperature range eliminates the need for additional thermal management in industrial applications, reducing BOM costs.
  • Compact Footprint: 84-TFBGA package in 8mm x 12.5mm dimensions conserves precious board real estate in space-constrained designs.
  • Parallel Interface Simplicity: Direct parallel connectivity enables straightforward integration with legacy systems and FPGA-based designs without requiring complex memory controllers.
  • Alliance Memory Reliability: Manufactured by Alliance Memory with focus on long-term availability, supporting designs requiring extended product lifecycles.
  • Active Lifecycle Status: Currently in active production, ensuring component availability for new designs and ongoing manufacturing requirements.

Why Choose AS4C16M16D2-25BINTR?

The AS4C16M16D2-25BINTR offers embedded system designers a dependable DDR2 SDRAM solution that balances performance, power efficiency, and environmental robustness. Its extended temperature rating and compact package make it particularly well-suited for industrial control systems, medical equipment, and networking applications where reliability under varying conditions is paramount. The mature DDR2 technology ensures broad tool support and straightforward design integration.

For applications requiring stable, long-term memory solutions with proven performance characteristics, the AS4C16M16D2-25BINTR provides a cost-effective foundation for embedded designs while maintaining the quality and availability standards expected from Alliance Memory.

Ready to Integrate?

Contact our technical sales team to discuss your specific memory requirements, request samples, or obtain a quote for the AS4C16M16D2-25BINTR. Our engineers can assist with design integration, performance optimization, and long-term availability planning for your project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up