AS4C16M16D2-25BCNTR
| Part Description |
IC DRAM 256MBIT PAR 84TFBGA |
|---|---|
| Quantity | 317 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 84-TFBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 400 ps | Grade | Commercial (Extended) | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0032 |
Overview of AS4C16M16D2-25BCNTR - 256Mbit DDR2 SDRAM with 400MHz Performance
The AS4C16M16D2-25BCNTR is a high-performance 256Mbit DDR2 SDRAM memory device from Alliance Memory, Inc. Built on proven DDR2 technology, this volatile memory solution delivers reliable data storage and retrieval for embedded systems, consumer electronics, and industrial applications. With a 16M x 16 organization and 400MHz clock frequency, this component provides the memory bandwidth needed for data-intensive processing tasks.
Designed for systems requiring moderate density memory with proven DDR2 compatibility, the AS4C16M16D2-25BCNTR offers a balance of performance, power efficiency, and cost-effectiveness. Its compact 84-TFBGA package minimizes board space while supporting parallel memory interfacing.
Key Features
- 256Mbit DDR2 SDRAM Core - Organized as 16M x 16, this DDR2 memory provides double data rate operation for efficient data throughput in synchronous applications.
- 400MHz Clock Frequency - Operates at up to 400MHz with 0.4ns access time, delivering the bandwidth required for real-time processing and buffering applications.
- Low Voltage Operation - Functions on 1.7V to 1.9V supply voltage, reducing power consumption compared to earlier SDRAM generations while maintaining DDR2 compatibility.
- 15ns Write Cycle Time - Supports rapid write operations with 15ns write cycle time for applications requiring frequent memory updates.
- Compact 84-TFBGA Package - Housed in an 8mm x 12.5mm thin fine-pitch BGA package, this component saves valuable PCB real estate in space-constrained designs.
- Commercial Temperature Range - Qualified for 0°C to 85°C (TC) operation, suitable for indoor commercial and industrial environments.
Typical Applications
- Embedded Computing Systems - This DDR2 SDRAM serves as main memory or buffer memory in embedded processors and controllers where moderate density volatile storage is required for program execution and data manipulation.
- Consumer Electronics - Provides working memory for set-top boxes, digital TVs, and home networking equipment where DDR2 compatibility and cost-effective memory density support multimedia processing and user interface functions.
- Industrial Control Systems - Functions as system memory in PLCs and HMI terminals where the commercial temperature range and proven DDR2 reliability ensure consistent operation in controlled industrial environments.
- Networking Equipment - Supports packet buffering and routing table storage in switches and routers where parallel memory access and moderate density meet the demands of network traffic management.
- Point-of-Sale Terminals - Delivers volatile memory for transaction processing and display buffering in retail systems where DDR2 technology provides a reliable, cost-effective memory solution.
Unique Advantages
- Proven DDR2 Technology: Leverages mature DDR2 standards for broad compatibility with existing system designs and reduces integration risk.
- Optimized Density-to-Cost Ratio: The 256Mbit capacity provides sufficient memory for many embedded applications without over-provisioning, helping control bill of materials costs.
- Space-Efficient Packaging: The compact 84-TFBGA footprint allows designers to maximize board density or reduce overall system size in space-critical applications.
- Lower Power Consumption: DDR2 architecture with sub-2V operation reduces power draw compared to legacy SDRAM, extending battery life in portable applications and reducing thermal management requirements.
- Parallel Interface Simplicity: Standard parallel memory interface simplifies hardware design and software drivers compared to serial memory alternatives, accelerating time to market.
- Active Lifecycle Status: With active production status, this component supports ongoing manufacturing and provides supply chain confidence for current and future production runs.
Why Choose AS4C16M16D2-25BCNTR?
The AS4C16M16D2-25BCNTR represents a practical choice for engineers seeking dependable DDR2 SDRAM memory in moderate densities. Alliance Memory's focus on memory solutions ensures consistent availability and support for this component, making it suitable for products with multi-year production lifecycles. The combination of standard DDR2 operation, commercial temperature tolerance, and compact packaging addresses common design requirements across commercial and industrial applications.
For designs where DDR2 compatibility, moderate density, and proven technology are priorities, this component delivers the essential memory functionality without unnecessary complexity. Its active lifecycle status and straightforward integration path make it appropriate for both new designs and product refreshes requiring reliable memory solutions.
Get a Quote Today
Contact our sales team to discuss pricing, availability, and volume requirements for the AS4C16M16D2-25BCNTR. Our technical support staff can assist with integration questions and provide additional documentation to support your design process.
