AS4C16M16D2-25BCN
| Part Description |
IC DRAM 256MBIT PAR 84TFBGA |
|---|---|
| Quantity | 391 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 84-TFBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 400 ps | Grade | Commercial (Extended) | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0032 |
Overview of AS4C16M16D2-25BCN - 256Mbit DDR2 SDRAM
The AS4C16M16D2-25BCN from Alliance Memory is a 256Mbit DDR2 SDRAM organized as 16M x 16 bits. This high-performance volatile memory operates at 400MHz clock frequency with a fast 0.4ns access time, making it suitable for demanding embedded applications requiring reliable data storage and rapid memory access.
Housed in a compact 84-TFBGA package measuring 8x12.5mm, this DDR2 memory device operates across a commercial temperature range of 0°C to 85°C and features a low-voltage supply range of 1.7V to 1.9V for power-efficient system designs.
Key Features
- High-Density Memory Architecture - 256Mbit capacity organized as 16M x 16 provides substantial data storage in a single device, reducing component count in memory subsystems.
- DDR2 SDRAM Technology - Double data rate architecture delivers high bandwidth through data transfers on both clock edges, maximizing throughput for memory-intensive applications.
- 400MHz Clock Frequency - High-speed operation with 0.4ns access time enables rapid data retrieval for latency-sensitive embedded systems.
- Low-Voltage Operation - 1.7V to 1.9V supply voltage range reduces power consumption compared to higher-voltage memory technologies.
- Commercial Temperature Range - Rated for 0°C to 85°C (TC) operation, suitable for indoor commercial and light industrial environments.
- Compact BGA Package - 84-TFBGA (8x12.5mm) footprint enables high-density PCB layouts while providing robust solder joint reliability.
- Parallel Memory Interface - Standard parallel interface ensures compatibility with a wide range of memory controllers and processors.
Typical Applications
- Networking Equipment - This DDR2 SDRAM provides high-bandwidth memory for routers, switches, and network appliances where packet buffering and routing table storage demand fast, reliable volatile memory.
- Industrial Control Systems - The commercial temperature rating and reliable operation make this memory suitable for PLCs, HMI panels, and factory automation controllers operating in controlled indoor environments.
- Consumer Electronics - Set-top boxes, digital TVs, and media players benefit from the high-density 256Mbit capacity and cost-effective DDR2 technology for video buffering and application execution.
- Embedded Computing - Single-board computers and embedded modules leverage the 16M x 16 organization for efficient system memory implementation with standard processor interfaces.
- Office Automation - Printers, copiers, and multifunction devices utilize this memory for image processing buffers and operating system support.
Unique Advantages
- Simplified Memory Design: The 16M x 16 organization allows designers to implement 256Mbit of memory with a single device, reducing PCB complexity and BOM costs.
- Power-Efficient Architecture: Low 1.7V to 1.9V operation minimizes power consumption in battery-backed and thermally constrained applications.
- Broad Temperature Compatibility: 0°C to 85°C operating range covers most commercial and light industrial deployment scenarios without requiring extended temperature variants.
- Space-Saving Footprint: The 84-TFBGA package delivers high memory density in minimal board space, valuable for compact embedded designs.
- Active Product Status: Currently in active production, ensuring long-term availability for new designs and ongoing production requirements.
Why Choose AS4C16M16D2-25BCN?
The AS4C16M16D2-25BCN represents a reliable DDR2 SDRAM solution for designers seeking proven memory technology with strong availability. Alliance Memory's commitment to the embedded market ensures consistent supply for production applications.
This memory is ideal for cost-sensitive designs that require DDR2 performance without the complexity of newer memory technologies. The combination of 400MHz operation, low-voltage supply, and commercial temperature support makes it a practical choice for a broad range of embedded systems, networking equipment, and consumer electronics applications.
Call to Action
Contact our sales team today to request a quote for the AS4C16M16D2-25BCN or to discuss your DDR2 memory requirements. Our technical support staff can assist with design-in questions and provide samples for evaluation.