AS4C16M16D2-25BIN
| Part Description |
IC DRAM 256MBIT PAR 84TFBGA |
|---|---|
| Quantity | 602 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 84-TFBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 400 ps | Grade | Automotive | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 84-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0032 |
Overview of AS4C16M16D2-25BIN - 256Mbit DDR2 SDRAM
The AS4C16M16D2-25BIN is a 256Mbit DDR2 SDRAM memory device from Alliance Memory, Inc., organized as 16M x 16 with a 400MHz clock frequency. This volatile parallel memory solution delivers reliable performance for embedded systems requiring cost-effective DDR2 memory with extended temperature operation from -40°C to 95°C.
Key Features
- Memory Architecture - 256Mbit capacity organized as 16M x 16, providing efficient data storage and retrieval for embedded applications.
- DDR2 Technology - Operates at 400MHz clock frequency with 4.0ns access time, offering balanced performance for cost-sensitive designs.
- Power Supply - 1.7V to 1.9V supply voltage range supports low-power operation while maintaining compatibility with standard DDR2 systems.
- Extended Temperature Range - -40°C to 95°C (TC) operating temperature ensures reliable performance in industrial and automotive environments.
- Compact Package - 84-pin TFBGA (8mm x 12.5mm) footprint enables space-efficient PCB layouts in size-constrained applications.
- Parallel Interface - Standard parallel memory interface simplifies integration with processors and controllers supporting DDR2 memory.
Typical Applications
- Industrial Automation - This DDR2 SDRAM provides reliable memory for PLCs, HMI systems, and industrial controllers where the extended temperature range ensures consistent operation in factory floor environments subject to temperature variations.
- Embedded Computing - The 256Mbit capacity and standard parallel interface make this device suitable for embedded processors in equipment requiring cost-effective volatile memory with moderate density requirements.
- Test and Measurement Equipment - The 400MHz clock frequency and 16M x 16 organization support data buffering and processing tasks in bench instruments operating across extended temperature conditions.
- Networking Infrastructure - This SDRAM can serve as buffer memory in switches, routers, and communication equipment where the parallel interface enables straightforward integration with network processors.
- Automotive Electronics - The -40°C to 95°C operating range makes this memory suitable for in-vehicle systems such as infotainment platforms and telematics units that must operate reliably across automotive temperature extremes.
Unique Advantages
- Reduce System Complexity: Standard DDR2 interface eliminates the need for custom memory controllers, simplifying design and reducing development time.
- Lower BOM Costs: Mainstream DDR2 technology offers competitive pricing compared to specialized memory solutions while meeting performance requirements for many embedded applications.
- Extended Operating Range: -40°C to 95°C temperature specification reduces the need for thermal management in industrial and automotive designs, lowering overall system cost.
- Space-Efficient Design: Compact 84-TFBGA package (8mm x 12.5mm) enables higher memory density per board area compared to larger package options.
- Active Lifecycle Status: Currently active product status provides confidence in long-term availability for designs requiring multi-year production runs.
- Industry-Standard Compatibility: DDR2 SDRAM technology ensures broad compatibility with existing processor platforms and established design practices.
Why Choose AS4C16M16D2-25BIN?
The AS4C16M16D2-25BIN delivers proven DDR2 SDRAM technology in a compact, temperature-tolerant package suitable for industrial, automotive, and embedded computing applications. With its 400MHz operation, extended temperature range, and standard parallel interface, this device simplifies memory subsystem design while providing reliable performance across demanding operating environments.
This memory solution is ideal for designs requiring cost-effective volatile memory with moderate density, extended temperature capability, and straightforward integration with DDR2-compatible processors and controllers.
Contact Us for Pricing and Availability
Request a quote for the AS4C16M16D2-25BIN to discuss volume pricing, lead times, and technical support for your application. Our sales team can provide detailed specifications and integration guidance to ensure this DDR2 SDRAM meets your design requirements.