AS4C16M16D1A-5TINTR

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 1,738 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B2AHTS Code8542.32.0024

Overview of AS4C16M16D1A-5TINTR - 256Mbit DDR1 SDRAM

The AS4C16M16D1A-5TINTR is a 256-megabit DDR1 SDRAM from Alliance Memory, Inc., organized as 16M x 16 in a 66-pin TSOP II package. This volatile memory solution operates at 200MHz clock frequency with a 7ns access time, delivering reliable performance for embedded systems requiring cost-effective DDR1 memory. Designed for the -40°C to 85°C industrial temperature range, this SDRAM serves applications where extended environmental tolerance is essential.

Key Features

  • Memory Architecture - 256Mbit (16M x 16) DDR1 SDRAM organization provides efficient data access with a parallel interface for straightforward integration into existing designs.
  • Performance Specifications - 200MHz clock frequency with 7ns access time and 15ns write cycle time ensures responsive data handling for real-time embedded applications.
  • Power Requirements - 2.3V to 2.7V supply voltage aligns with standard DDR1 specifications, simplifying power supply design and reducing board complexity.
  • Industrial Temperature Range - -40°C to 85°C (TA) operation extends deployment options beyond commercial environments into industrial control systems and harsh-environment applications.
  • Package Format - 66-pin TSOP II (10.16mm width) footprint offers a compact form factor with established manufacturing compatibility and proven reliability.

Typical Applications

  • Industrial Control Systems - This DDR1 SDRAM provides reliable working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the extended temperature range ensures consistent operation in factory floor environments.
  • Embedded Computing Platforms - The 256Mbit capacity and 200MHz clock frequency support real-time operating systems and application code execution in embedded processors requiring cost-effective volatile memory.
  • Networking Equipment - Parallel interface and predictable access times make this SDRAM suitable for packet buffering and routing tables in managed switches and routers operating in industrial networking applications.
  • Test and Measurement Instruments - The industrial temperature rating and stable performance characteristics support data acquisition systems and diagnostic equipment used in field service environments.
  • Legacy System Upgrades - As a DDR1 solution, this component enables memory upgrades or replacements in existing designs originally specified with DDR1 SDRAM, extending product lifecycles.

Unique Advantages

  • Extended Temperature Qualification: The -40°C to 85°C operating range eliminates the need for additional thermal management in many industrial applications, reducing system cost and complexity.
  • Industry-Standard Footprint: The 66-pin TSOP II package enables drop-in compatibility with existing DDR1 designs, minimizing redesign risk and accelerating time to market for product refreshes.
  • Proven DDR1 Technology: Mature SDRAM technology offers predictable behavior, extensive driver support, and simplified validation compared to adopting newer memory standards for cost-sensitive applications.
  • Balanced Capacity: 256Mbit density provides sufficient memory for embedded applications without over-provisioning, optimizing bill-of-materials cost for target use cases.
  • Parallel Interface Simplicity: Standard parallel memory bus integration reduces controller complexity compared to serial memory alternatives, particularly beneficial for legacy processor compatibility.
  • Active Lifecycle Status: Current production availability supports new designs and provides supply continuity for existing products requiring long-term component sourcing.

Why Choose AS4C16M16D1A-5TINTR?

The AS4C16M16D1A-5TINTR addresses the ongoing need for industrial-grade DDR1 SDRAM in embedded systems where proven technology, extended temperature operation, and cost optimization take priority over cutting-edge performance. This component is ideal for industrial control, legacy system support, and embedded applications where DDR1 remains the specified memory standard. The combination of Alliance Memory's focus on memory solutions with the established reliability of TSOP II packaging provides a dependable foundation for designs requiring multi-year production support.

For designs balancing performance requirements with environmental robustness and total cost of ownership, this DDR1 SDRAM delivers the memory functionality needed without unnecessary complexity or premium pricing associated with newer memory technologies.

Get a Quote

Contact our sales team for pricing, availability, and technical support for the AS4C16M16D1A-5TINTR. We can assist with sample requests, volume pricing, and application-specific guidance to ensure this DDR1 SDRAM meets your project requirements.

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