AS4C16M16D1-5TINTR
| Part Description |
IC DRAM 256MBIT PAR 66TSOP II |
|---|---|
| Quantity | 1,092 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0032 |
Overview of AS4C16M16D1-5TINTR - 256Mb DDR SDRAM
The AS4C16M16D1-5TINTR is a 256-megabit synchronous dynamic random access memory (SDRAM) module utilizing DDR (Double Data Rate) technology. Organized as 16M x 16, this volatile memory device operates at a 200MHz clock frequency with a 7ns access time, making it well-suited for applications requiring fast data transfer rates. Housed in a 66-pin TSOP II package, it offers reliable memory expansion for embedded systems and industrial equipment.
Key Features
- Memory Architecture - 256Mb total capacity organized as 16M x 16, providing flexible integration for 16-bit data bus systems.
- DDR SDRAM Technology - Double data rate operation transfers data on both rising and falling clock edges, effectively doubling throughput compared to standard SDRAM at the same clock frequency.
- Performance Specifications - 200MHz clock frequency with 7ns access time and 15ns write cycle time ensures responsive memory performance for time-sensitive applications.
- Power Supply - Operates on 2.3V to 2.7V supply voltage, compatible with low-power embedded designs.
- Industrial Temperature Range - Rated for operation from -40°C to 85°C, supporting deployment in harsh environmental conditions.
- Package Format - 66-pin TSOP II (0.400", 10.16mm width) package provides a compact footprint for space-constrained PCB layouts.
Typical Applications
- Industrial Control Systems - This DDR SDRAM provides working memory for programmable logic controllers (PLCs) and distributed control systems where the extended temperature rating ensures reliable operation in factory floor and outdoor industrial environments.
- Embedded Computing - Serves as main memory for embedded processors and microcontrollers in applications such as point-of-sale terminals, kiosks, and data acquisition systems that require fast volatile storage for program execution and data buffering.
- Communications Equipment - Supports network routers, switches, and telecommunications infrastructure where the parallel interface and DDR performance facilitate packet buffering and routing table management.
- Test and Measurement Instruments - Provides data capture and processing memory for oscilloscopes, logic analyzers, and automated test equipment that require high-speed temporary storage during measurement cycles.
Unique Advantages
- Extended Temperature Tolerance: The -40°C to 85°C operating range reduces the need for additional thermal management components in industrial designs, simplifying system architecture and lowering BOM costs.
- Proven DDR Technology: DDR SDRAM offers a mature, well-understood memory architecture with broad ecosystem support, reducing integration risk and development time compared to newer memory technologies.
- Standard Parallel Interface: The parallel memory interface eliminates the need for complex serial controllers, simplifying firmware development and reducing latency for direct memory access applications.
- Compact TSOP II Package: The narrow 10.16mm width package optimizes board space utilization in space-constrained designs while maintaining compatibility with standard SMT assembly processes.
- Flexible Memory Organization: The 16M x 16 configuration aligns naturally with 16-bit microcontroller and processor architectures, minimizing address decoding complexity and improving memory access efficiency.
Why Choose AS4C16M16D1-5TINTR?
The AS4C16M16D1-5TINTR delivers a balanced combination of capacity, speed, and environmental tolerance for industrial and embedded applications. Its 256Mb density provides sufficient memory for many embedded operating systems and real-time applications, while the DDR architecture ensures data throughput keeps pace with modern processor requirements. The industrial temperature rating makes this component particularly suitable for designs destined for harsh operating environments where consumer-grade memory would require additional protection.
For engineering teams working on legacy system maintenance or designs requiring proven memory technology with long-term availability considerations, this Alliance Memory DDR SDRAM offers a reliable foundation for industrial-grade embedded systems.
Ready to Integrate AS4C16M16D1-5TINTR?
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