AS4C16M16D1-5TINTR

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 1,092 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0032

Overview of AS4C16M16D1-5TINTR - 256Mb DDR SDRAM

The AS4C16M16D1-5TINTR is a 256-megabit synchronous dynamic random access memory (SDRAM) module utilizing DDR (Double Data Rate) technology. Organized as 16M x 16, this volatile memory device operates at a 200MHz clock frequency with a 7ns access time, making it well-suited for applications requiring fast data transfer rates. Housed in a 66-pin TSOP II package, it offers reliable memory expansion for embedded systems and industrial equipment.

Key Features

  • Memory Architecture - 256Mb total capacity organized as 16M x 16, providing flexible integration for 16-bit data bus systems.
  • DDR SDRAM Technology - Double data rate operation transfers data on both rising and falling clock edges, effectively doubling throughput compared to standard SDRAM at the same clock frequency.
  • Performance Specifications - 200MHz clock frequency with 7ns access time and 15ns write cycle time ensures responsive memory performance for time-sensitive applications.
  • Power Supply - Operates on 2.3V to 2.7V supply voltage, compatible with low-power embedded designs.
  • Industrial Temperature Range - Rated for operation from -40°C to 85°C, supporting deployment in harsh environmental conditions.
  • Package Format - 66-pin TSOP II (0.400", 10.16mm width) package provides a compact footprint for space-constrained PCB layouts.

Typical Applications

  • Industrial Control Systems - This DDR SDRAM provides working memory for programmable logic controllers (PLCs) and distributed control systems where the extended temperature rating ensures reliable operation in factory floor and outdoor industrial environments.
  • Embedded Computing - Serves as main memory for embedded processors and microcontrollers in applications such as point-of-sale terminals, kiosks, and data acquisition systems that require fast volatile storage for program execution and data buffering.
  • Communications Equipment - Supports network routers, switches, and telecommunications infrastructure where the parallel interface and DDR performance facilitate packet buffering and routing table management.
  • Test and Measurement Instruments - Provides data capture and processing memory for oscilloscopes, logic analyzers, and automated test equipment that require high-speed temporary storage during measurement cycles.

Unique Advantages

  • Extended Temperature Tolerance: The -40°C to 85°C operating range reduces the need for additional thermal management components in industrial designs, simplifying system architecture and lowering BOM costs.
  • Proven DDR Technology: DDR SDRAM offers a mature, well-understood memory architecture with broad ecosystem support, reducing integration risk and development time compared to newer memory technologies.
  • Standard Parallel Interface: The parallel memory interface eliminates the need for complex serial controllers, simplifying firmware development and reducing latency for direct memory access applications.
  • Compact TSOP II Package: The narrow 10.16mm width package optimizes board space utilization in space-constrained designs while maintaining compatibility with standard SMT assembly processes.
  • Flexible Memory Organization: The 16M x 16 configuration aligns naturally with 16-bit microcontroller and processor architectures, minimizing address decoding complexity and improving memory access efficiency.

Why Choose AS4C16M16D1-5TINTR?

The AS4C16M16D1-5TINTR delivers a balanced combination of capacity, speed, and environmental tolerance for industrial and embedded applications. Its 256Mb density provides sufficient memory for many embedded operating systems and real-time applications, while the DDR architecture ensures data throughput keeps pace with modern processor requirements. The industrial temperature rating makes this component particularly suitable for designs destined for harsh operating environments where consumer-grade memory would require additional protection.

For engineering teams working on legacy system maintenance or designs requiring proven memory technology with long-term availability considerations, this Alliance Memory DDR SDRAM offers a reliable foundation for industrial-grade embedded systems.

Ready to Integrate AS4C16M16D1-5TINTR?

Contact our technical sales team to discuss your memory requirements, request detailed specifications, or obtain pricing for your project. Our team can assist with memory selection, integration guidance, and volume quotations tailored to your application.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up