AS4C16M16D1-5TCNTR

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 1,078 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0032

Overview of AS4C16M16D1-5TCNTR - 256Mb DDR SDRAM Module

The AS4C16M16D1-5TCNTR from Alliance Memory is a 256Mb DDR SDRAM integrated circuit featuring a 16M x 16 organization. This volatile memory device operates at 200MHz clock frequency with a 7ns access time, delivering reliable parallel data storage for embedded systems and computing applications requiring cost-effective, high-density DRAM solutions.

Key Features

  • Memory Architecture - DDR SDRAM technology with 16M x 16 bit organization provides 256Mb total capacity for efficient data handling in parallel interface designs.
  • Performance Specifications - 200MHz clock frequency with 7ns access time and 15ns write cycle time enables fast data transfer rates suitable for real-time processing applications.
  • Power Supply - Operates on 2.3V to 2.7V supply voltage, supporting low-power system designs while maintaining SDRAM performance standards.
  • Operating Temperature Range - Commercial temperature range of 0°C to 70°C (TA) makes this device suitable for standard indoor computing and consumer electronics environments.
  • Package Format - Available in 66-TSOP II package (0.400", 10.16mm width) for space-efficient PCB layouts with standard surface mount assembly processes.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main memory in embedded controllers and single-board computers where parallel DDR interface provides adequate bandwidth for processor data access and buffering operations.
  • Consumer Electronics - Digital set-top boxes, media players, and home appliances utilize this memory for firmware execution and temporary data storage where commercial temperature ratings meet product requirements.
  • Network Equipment - Routers, switches, and network interface cards implement this DRAM for packet buffering and routing table storage in controlled-environment installations.
  • Telecommunications Infrastructure - Base stations and communication modules use this memory for signal processing buffers and protocol stack operations in temperature-controlled cabinets.

Unique Advantages

  • Standard DDR Interface: Parallel DDR SDRAM interface simplifies integration with legacy processors and controllers supporting standard JEDEC DDR specifications without custom interface logic.
  • Proven DRAM Technology: Volatile SDRAM architecture offers straightforward implementation with well-established design practices and broad ecosystem support for faster time-to-market.
  • Cost-Effective Density: 256Mb capacity in single-chip package reduces component count and PCB space compared to multiple lower-density devices for equivalent storage.
  • Industry-Standard Package: 66-TSOP II form factor enables compatibility with existing board designs and standard pick-and-place assembly equipment without tooling changes.
  • Established Supply Chain: Alliance Memory's focus on memory solutions provides consistent availability for production planning and lifecycle management.

Why Choose AS4C16M16D1-5TCNTR?

The AS4C16M16D1-5TCNTR addresses the need for reliable, cost-effective DDR SDRAM in designs where parallel memory interfaces are already implemented and 256Mb capacity meets application requirements. Its commercial temperature rating and standard package make it well-suited for indoor electronics, embedded systems, and network infrastructure deployed in controlled environments.

For designers working with legacy platforms or systems requiring parallel DDR memory, this device offers straightforward integration using established JEDEC standards. The 16M x 16 organization provides flexibility for various data bus configurations while maintaining compatibility with common memory controller architectures.

Get a Quote

Contact our sales team for pricing, availability, and technical support on the AS4C16M16D1-5TCNTR. We can assist with volume requirements, alternative packaging options, and integration guidance for your specific application needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up