AS4C16M16D1-5TCN

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 1,217 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C16M16D1-5TCN - 256Mbit DDR SDRAM in 66-TSOP II Package

The AS4C16M16D1-5TCN from Alliance Memory is a 256-megabit DDR SDRAM organized as 16M x 16, designed for cost-sensitive applications requiring high-speed synchronous memory. Built on proven DDR1 technology, this volatile memory device operates at clock frequencies up to 200MHz with a 7ns access time, making it suitable for embedded systems, consumer electronics, and legacy industrial designs. With a wide operating temperature range of 0°C to 70°C, it delivers reliable performance in commercial environments.

Key Features

  • Memory Architecture - 256Mbit density organized as 16M x 16, providing a balanced word width for efficient data transfer in embedded applications.
  • DDR SDRAM Technology - Double data rate architecture delivers data on both rising and falling clock edges at 200MHz, doubling throughput compared to conventional SDRAM.
  • Fast Access Time - 7ns access time with 15ns write cycle time enables responsive performance for time-sensitive operations.
  • Low Voltage Operation - 2.3V to 2.7V supply voltage reduces power consumption and heat generation in compact designs.
  • Parallel Interface - Standard parallel memory interface simplifies integration with legacy microcontrollers and processors.
  • 66-TSOP II Package - Space-efficient 0.400" (10.16mm) width TSOP package optimizes board layout for compact systems.
  • Commercial Temperature Range - 0°C to 70°C operating range ensures stable operation in controlled indoor environments.

Typical Applications

  • Embedded Systems - This DDR SDRAM provides working memory for single-board computers and embedded controllers where its 16-bit organization matches common processor bus widths, simplifying hardware design.
  • Consumer Electronics - The device supports legacy set-top boxes, digital displays, and entertainment systems where cost-effective memory with moderate speed requirements enables product longevity and serviceability.
  • Industrial Control Systems - Commercial temperature tolerance makes this memory suitable for programmable logic controllers and HMI panels operating in climate-controlled industrial facilities.
  • Legacy Product Maintenance - As a replacement component for obsolete designs, this SDRAM enables continued production and repair of established product lines without costly redesigns.
  • Test and Measurement Equipment - The parallel interface and proven DDR technology provide reliable data buffering for benchtop instruments and laboratory equipment requiring stable memory performance.

Unique Advantages

  • Cost-Effective Memory Solution: DDR1 technology at commercial grade provides an economical option for applications where cutting-edge performance is not required.
  • Simplified Hardware Design: Standard parallel interface eliminates the need for complex memory controllers, reducing development time and component count.
  • Drop-In Compatibility: Industry-standard 66-TSOP II footprint allows for direct replacement in existing designs without board layout changes.
  • Proven Reliability: Mature DDR SDRAM technology offers well-understood operating characteristics and predictable performance over the product lifecycle.
  • Power Efficiency: Low voltage operation at 2.3V to 2.7V minimizes power draw, extending battery life in portable applications and reducing thermal management requirements.
  • Balanced Organization: 16M x 16 architecture aligns with 16-bit microcontroller and DSP bus widths, optimizing data transfer efficiency without requiring width conversion logic.

Why Choose AS4C16M16D1-5TCN?

The AS4C16M16D1-5TCN represents a practical choice for designers working with legacy systems, cost-sensitive consumer products, or applications where established DDR1 technology meets performance requirements. Its commercial temperature rating and standard package make it particularly well-suited for indoor equipment where environmental extremes are not a concern. While this component carries an obsolete lifecycle status, it remains valuable for sustaining existing product lines, supporting field repairs, and maintaining continuity for established designs.

For engineering teams managing long-lifecycle products or maintaining compatibility with existing architectures, this Alliance Memory SDRAM offers a balance of proven technology, straightforward integration, and economic efficiency. The 256Mbit density provides sufficient working memory for embedded applications without overspecifying capacity, helping control both component costs and power budgets.

Get Started

To request a quote for the AS4C16M16D1-5TCN or discuss availability for your specific application requirements, contact our sales team. We can provide technical support, volume pricing, and lead time information to help you make informed sourcing decisions for your project.

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