AS4C32M16D1A-5TIN

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 103 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D1A-5TIN - 512Mbit DDR SDRAM in 66-TSOP II Package

The AS4C32M16D1A-5TIN is a 512Mbit DDR SDRAM from Alliance Memory featuring a 32M x 16 memory organization. This parallel interface memory device operates at clock frequencies up to 200MHz and delivers fast 0.7ns access times, making it well-suited for embedded systems and industrial applications requiring reliable volatile memory storage.

Designed for operation across an extended temperature range of -40°C to 85°C, this SDRAM provides consistent performance in demanding environments where standard commercial-grade components may not suffice.

Key Features

  • Memory Capacity and Organization - 512Mbit total capacity organized as 32M x 16, providing efficient word-width access for 16-bit data bus architectures.
  • DDR SDRAM Technology - Double data rate architecture transfers data on both clock edges, effectively doubling throughput compared to single data rate SDRAM at the same clock frequency.
  • High-Speed Operation - 200MHz clock frequency with 0.7ns access time and 15ns write cycle time enables responsive memory transactions for performance-sensitive applications.
  • Extended Temperature Range - Operates reliably from -40°C to 85°C (TA), supporting deployment in industrial and outdoor environments with wide ambient temperature variations.
  • Low Voltage Operation - 2.3V to 2.7V supply voltage range reduces power consumption and provides compatibility with low-power system designs.
  • Industry-Standard Package - 66-TSOP II package (0.400", 10.16mm width) offers a proven form factor with established PCB footprints and second-sourcing options.

Typical Applications

  • Industrial Control Systems - This DDR SDRAM serves as program and data memory in PLCs, motor drives, and process controllers where the extended temperature range ensures reliable operation in factory floor environments.
  • Embedded Computing - The 32M x 16 organization and parallel interface integrate efficiently with embedded processors and FPGAs requiring external memory expansion for buffering, caching, or code execution.
  • Networking Equipment - Routers, switches, and access points utilize this SDRAM for packet buffering and routing table storage, benefiting from the 200MHz clock speed for high-throughput data handling.
  • Medical Devices - Patient monitoring systems and diagnostic equipment leverage the industrial temperature rating and consistent availability for designs requiring long product lifecycles.
  • Test and Measurement - Data acquisition systems and instrumentation use this memory for sample buffering where fast write cycles and reliable operation across temperature extremes are essential.

Unique Advantages

  • Long-Term Availability: Alliance Memory specializes in providing memory products with extended lifecycle support, reducing redesign risk for applications with multi-year production requirements.
  • Drop-In Compatibility: Pin-compatible with industry-standard DDR SDRAM devices, simplifying second-sourcing strategies and minimizing qualification effort for existing designs.
  • Industrial Temperature Grade: The -40°C to 85°C operating range addresses applications where commercial temperature parts cannot meet environmental specifications, eliminating the need for thermal management compromises.
  • Optimized Power Profile: The 2.3V to 2.7V supply range supports battery-powered and power-sensitive designs while maintaining full performance specifications.
  • Proven Package Technology: The 66-TSOP II package provides robust mechanical and thermal characteristics suitable for high-reliability applications with established manufacturing processes.

Why Choose the AS4C32M16D1A-5TIN?

The AS4C32M16D1A-5TIN addresses the needs of designers seeking a reliable 512Mbit DDR SDRAM with industrial temperature support and long-term availability. Its combination of 200MHz operation, 32M x 16 organization, and extended temperature range makes it particularly suitable for embedded and industrial applications where performance and environmental resilience are equally important.

For engineering teams designing products with extended production lifecycles, this memory device offers the assurance of continued supply and drop-in compatibility that simplifies inventory management and reduces component obsolescence risk.

Get Started

Contact our sales team for volume pricing, technical documentation, and sample availability. Our application engineers can assist with design-in support and help identify the optimal memory solution for your specific requirements.

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