AS4C32M16D1A-5TCNTR

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 486 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B2AHTS Code8542.32.0024

Overview of AS4C32M16D1A-5TCNTR - 512Mbit DDR SDRAM Memory IC

The AS4C32M16D1A-5TCNTR from Alliance Memory is a 512Mbit DDR SDRAM memory integrated circuit designed for high-performance digital applications. This volatile memory device features a 32M x 16 organization with parallel interface, delivering reliable data storage and retrieval at 200MHz clock frequency. Ideal for systems requiring fast memory access with standard operating temperature ranges, this DRAM solution serves embedded systems, networking equipment, and general computing applications.

Key Features

  • Memory Architecture: 512Mbit capacity organized as 32M x 16, providing flexible addressing for diverse system architectures and efficient data management in memory-intensive applications.
  • DDR SDRAM Technology: Double Data Rate Synchronous DRAM operates at 200MHz clock frequency with 0.7ns access time, enabling high-speed data transfer for demanding real-time processing requirements.
  • Power Supply: Operates on 2.3V to 2.7V supply voltage, supporting low-power design implementations while maintaining reliable performance across the voltage range.
  • Parallel Interface: Standard parallel memory interface simplifies integration with existing processor architectures and memory controllers, reducing design complexity.
  • Package: Available in 66-TSOP II (10.16mm width) package, offering a compact footprint suitable for space-constrained board layouts.
  • Operating Temperature: Rated for 0°C to 70°C ambient temperature range, supporting commercial and industrial applications in controlled environments.

Typical Applications

  • Networking Equipment: This DDR SDRAM provides fast buffer memory for routers, switches, and network appliances where rapid packet processing and temporary data storage are critical for maintaining throughput.
  • Embedded Computing: Serves as main memory or cache in embedded processors and microcontroller systems, offering the speed and capacity needed for running complex firmware and real-time operating systems.
  • Communications Infrastructure: Powers memory subsystems in telecommunications equipment and base stations where reliable volatile memory supports signal processing and data buffering operations.
  • Industrial Control Systems: Enables data acquisition and control applications in industrial environments, providing the memory bandwidth required for sensor data processing and control algorithm execution within the commercial temperature range.
  • Test and Measurement: Supports high-speed data capture and analysis in test equipment where temporary storage of waveforms and measurement data requires fast memory access.

Unique Advantages

  • Proven DDR Technology: Leverages mature and widely-supported DDR SDRAM architecture, ensuring compatibility with standard memory controllers and reducing design risk.
  • Fast Access Performance: 0.7ns access time and 200MHz operation enable low-latency memory operations, improving overall system responsiveness in time-critical applications.
  • Standard Industry Package: 66-TSOP II form factor is well-established in the industry, facilitating procurement of compatible sockets and simplifying PCB layout with proven footprint standards.
  • Active Lifecycle Status: Current production availability supports both new designs and long-term product lifecycles, reducing obsolescence concerns for multi-year projects.
  • Straightforward Integration: Parallel interface with standard DDR protocol eliminates the need for complex interface logic, shortening development cycles.
  • Cost-Effective Memory Solution: Combines adequate capacity with proven technology to deliver reliable volatile memory at competitive pricing for commercial applications.

Why Choose AS4C32M16D1A-5TCNTR?

The AS4C32M16D1A-5TCNTR represents a solid choice for designs requiring reliable DDR SDRAM memory in commercial temperature environments. Its 512Mbit capacity and 200MHz operation strike a practical balance for embedded systems, networking products, and industrial equipment where proven technology and supply continuity matter. The parallel interface and standard package simplify integration while the 0°C to 70°C operating range covers typical commercial and many industrial use cases.

For engineering teams prioritizing established memory technology with active production support, this Alliance Memory DDR SDRAM offers a dependable foundation for both new product development and sustaining engineering projects requiring memory component longevity.

Get a Quote

To request pricing, check stock availability, or discuss volume requirements for the AS4C32M16D1A-5TCNTR, contact our sales team. We can provide detailed specifications, application support, and delivery schedules tailored to your project timeline.

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