AS4C32M16D1-5TINTR

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 104 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0032

Overview of AS4C32M16D1-5TINTR - 512Mbit DDR SDRAM Memory IC

The AS4C32M16D1-5TINTR from Alliance Memory is a high-performance 512Mbit DDR SDRAM memory IC organized as 32M x 16. This parallel interface DRAM delivers fast access times and reliable data storage for embedded systems, industrial equipment, and legacy computing applications. With a 200MHz clock frequency and 7ns access time, this device provides the speed and capacity needed for memory-intensive operations in a compact 66-pin TSOP II package.

Key Features

  • High-Density Memory Architecture - 512Mbit capacity organized as 32M x 16 provides substantial storage for data-intensive applications while maintaining efficient address mapping.
  • DDR SDRAM Technology - Double data rate synchronous DRAM transfers data on both rising and falling clock edges, effectively doubling throughput compared to standard SDRAM at 200MHz clock frequency.
  • Fast Access Performance - 7ns access time and 15ns write cycle time ensure responsive memory operations for real-time processing requirements.
  • Standard Parallel Interface - Conventional parallel memory interface simplifies integration into existing designs and provides broad compatibility with legacy systems.
  • Low Voltage Operation - 2.3V to 2.7V supply voltage reduces power consumption while maintaining performance specifications.
  • Extended Temperature Range - -40°C to 85°C operating temperature supports deployment in industrial and automotive environments where temperature extremes are common.
  • Industry-Standard Package - 66-pin TSOP II package (10.16mm width) fits standard PCB footprints and supports automated assembly processes.

Typical Applications

  • Industrial Control Systems - This DDR SDRAM serves as main memory in PLCs and industrial computers where the extended temperature range ensures reliable operation in factory floor conditions and the 512Mbit capacity handles control logic and data buffering requirements.
  • Legacy System Maintenance - Engineers use this memory IC for repairing and maintaining existing equipment where DDR SDRAM components are needed to keep critical systems operational beyond their original production lifecycle.
  • Embedded Computing Platforms - This device provides working memory for embedded processors in test equipment, medical devices, and automation controllers where the parallel interface integrates with established processor architectures.
  • Network Equipment - Routers, switches, and communication devices utilize this SDRAM for packet buffering and routing tables where fast access times support wire-speed packet processing.
  • Data Acquisition Systems - This memory IC buffers high-speed sensor data and measurement results in instrumentation where the write cycle time matches typical ADC conversion rates.

Unique Advantages

  • Proven DDR Technology: Mature DDR SDRAM architecture provides well-understood timing characteristics and design patterns that reduce development risk and simplify validation.
  • Wide Temperature Tolerance: -40°C to 85°C operation eliminates the need for thermal management in many industrial installations, reducing system complexity and cost.
  • Parallel Interface Compatibility: Direct connection to parallel memory buses avoids the complexity and latency of serial-to-parallel conversion required by newer memory technologies.
  • Standard Footprint: TSOP II package matches existing PCB layouts, enabling drop-in replacement or second-sourcing without board redesign.
  • Balanced Performance: 200MHz clock frequency and 7ns access time deliver sufficient speed for control and embedded applications without the cost premium of higher-speed specialty memory.
  • Extended Lifecycle Support: Alliance Memory's focus on long-term availability helps maintain spare part inventories for systems with multi-year service commitments.

Why Choose AS4C32M16D1-5TINTR?

The AS4C32M16D1-5TINTR addresses the specific requirements of industrial and embedded applications where proven technology and extended temperature performance take precedence over cutting-edge density. This DDR SDRAM offers engineers a reliable memory solution for designs that require parallel interface compatibility and operation in demanding thermal environments. The 512Mbit capacity provides adequate working memory for control systems, communication equipment, and instrumentation without over-specifying for applications that don't require gigabit-scale density.

For system designs requiring long-term component availability and straightforward integration with parallel memory controllers, this Alliance Memory device delivers practical performance specifications in a widely-supported package format. The extended temperature rating and standard voltage operation make it particularly suitable for industrial equipment that must function reliably across diverse installation environments.

Get a Quote

Contact our sales team to request pricing and availability for the AS4C32M16D1-5TINTR. Our technical support staff can assist with integration questions, timing analysis, and PCB layout recommendations to help you implement this DDR SDRAM in your next design.

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