AS4C32M16D1-5BINTR

IC DRAM 512MBIT PAR 60TFBGA
Part Description

IC DRAM 512MBIT PAR 60TFBGA

Quantity 1,130 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D1-5BINTR - 512Mbit DDR SDRAM Memory IC

The AS4C32M16D1-5BINTR is a 512-megabit DDR SDRAM integrated circuit from Alliance Memory, designed to deliver reliable, high-speed parallel memory for embedded systems and industrial applications. Organized as 32M x 16, this volatile memory device operates at 200MHz with a 7ns access time, providing the performance needed for data-intensive applications while maintaining extended temperature operation from -40°C to 85°C.

Key Features

  • Memory Architecture - 512Mbit capacity organized as 32M x 16, providing flexible word-width access for efficient data throughput in 16-bit system architectures.
  • DDR SDRAM Technology - Double data rate synchronous DRAM transfers data on both rising and falling clock edges at 200MHz, doubling effective bandwidth compared to single data rate memory.
  • Fast Access Performance - 7ns access time and 15ns write cycle time enable rapid read/write operations for time-sensitive embedded applications.
  • Power Supply - Operates on 2.3V to 2.7V supply voltage, compatible with modern low-power digital systems and reducing overall power consumption.
  • Extended Temperature Range - Qualified for -40°C to 85°C ambient operation, ensuring reliable performance in industrial and outdoor environments.
  • Compact Package - 60-pin TFBGA (8mm x 13mm) footprint minimizes board space while providing robust parallel interface connections.

Typical Applications

  • Industrial Automation - This DDR SDRAM provides reliable memory buffering for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where extended temperature tolerance ensures consistent operation in factory environments.
  • Embedded Computing Systems - The 512Mbit capacity and parallel interface make this device suitable for microprocessor-based embedded systems requiring local working memory for data processing and temporary storage.
  • Test and Measurement Equipment - The fast 200MHz operation and 7ns access time support high-speed data acquisition and signal processing applications where rapid memory access is critical for real-time analysis.
  • Communication Infrastructure - Provides buffer memory for routers, switches, and network appliances operating in telecommunications closets and outdoor enclosures where industrial temperature ratings are required.
  • Medical Devices - Serves as working memory in diagnostic and monitoring equipment where reliable operation across temperature extremes ensures patient safety and accurate measurements.

Unique Advantages

  • Simplified BOM Management: Single-source 512Mbit DDR SDRAM reduces component proliferation and simplifies procurement for industrial designs.
  • Design Flexibility: 32M x 16 organization matches common 16-bit microprocessor and DSP architectures, minimizing glue logic requirements.
  • Industrial-Grade Reliability: Extended -40°C to 85°C operation eliminates the need for thermal management systems in harsh environment deployments.
  • Space-Efficient Integration: Compact 60-TFBGA package with 8mm x 13mm footprint reduces PCB area requirements compared to larger parallel memory packages.
  • Performance Without Compromise: 200MHz DDR operation delivers the bandwidth needed for real-time processing while maintaining stable performance across the full temperature range.
  • Active Lifecycle Status: Ongoing production availability supports long product lifecycles typical of industrial and embedded applications.

Why Choose AS4C32M16D1-5BINTR?

The AS4C32M16D1-5BINTR addresses the specific requirements of industrial and embedded system designers who need proven DDR SDRAM technology with extended temperature operation. Unlike consumer-grade memory components, this device maintains full specifications across the -40°C to 85°C range, making it suitable for outdoor installations, factory automation, and vehicular applications where environmental conditions vary widely.

For design teams developing products with multi-year lifecycles, the Active status and established Alliance Memory supply chain provide the long-term availability assurance that industrial applications demand. The 60-TFBGA package offers excellent board-level reliability while supporting automated assembly processes.

Request a Quote

Contact our sales team for pricing, availability, and technical support for the AS4C32M16D1-5BINTR. Our engineers can assist with integration guidance, reference designs, and volume pricing for your next industrial or embedded memory project.

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