AS4C32M16D1-5TCN

The AS4C32M16D1-5TCN from Alliance Memory is a 512-megabit synchronous dynamic random access memory (SDRAM) device utilizing DDR (Double Data Rate) technology. Organized as 32M x 16, this parallel-interface DRAM operates at a 200MHz clock frequency and supports standard commercial temperature ranges. It is designed for embedded systems and computing applications requiring cost-effective volatile memory solutions with moderate speed and density.

Key Features

• Memory Architecture - 512Mbit density organized as 32M x 16, providing flexible data path width for system design optimization.
• DDR SDRAM Technology - Double data rate operation at 200MHz clock frequency with 7ns access time delivers efficient throughput for mainstream applications.
• Power Supply - Operates from 2.3V to 2.7V supply voltage, compatible with low-voltage system designs for reduced power consumption.
• Parallel Interface - Standard parallel memory interface with 15ns write cycle time simplifies integration with existing memory controller architectures.
• Package Format - Available in 66-pin TSOP II (10.16mm width) package, a widely adopted form factor for space-constrained PCB layouts.
• Temperature Range - Commercial-grade operation from 0°C to 70°C supports typical indoor equipment environments.

Typical Applications

• Embedded Computing Systems - This DDR SDRAM provides working memory for embedded controllers and single-board computers where moderate density and cost efficiency are prioritized over extreme performance.
• Network Equipment - The parallel interface and standard voltage operation make this memory suitable for buffering and packet processing in routers, switches, and network appliances operating in controlled environments.
• Consumer Electronics - The 512Mbit density and commercial temperature range support set-top boxes, digital displays, and multimedia devices requiring volatile memory for real-time data processing.
• Industrial Control Panels - The TSOP II package and standard DDR interface integrate into HMI terminals and control systems deployed in climate-controlled industrial settings.

Unique Advantages

• Proven DDR Technology: Leverages mature DDR SDRAM architecture with widespread controller support, reducing design risk and time-to-market.
• Standard Form Factor: TSOP II packaging offers high-density mounting on standard PCBs without specialized assembly processes.
• Flexible Organization: 32M x 16 architecture balances data path width and address space for diverse system memory requirements.
• Low Voltage Operation: 2.3V to 2.7V supply range reduces system power budgets and heat dissipation requirements.
• Mainstream Performance: 200MHz clock frequency and 7ns access time provide adequate speed for embedded applications without premium pricing.

Why Choose AS4C32M16D1-5TCN?

The AS4C32M16D1-5TCN offers a reliable memory solution for commercial-grade embedded systems requiring 512Mbit density with DDR performance. Its standard parallel interface, proven TSOP II packaging, and compatibility with established memory controllers make it a straightforward integration choice for designs prioritizing component availability and predictable behavior over cutting-edge specifications.

This component suits projects with moderate memory bandwidth requirements operating in controlled temperature environments. The 32M x 16 organization provides flexibility for system architects balancing address space and data path considerations.

Request a Quote

Contact our technical sales team to discuss AS4C32M16D1-5TCN pricing, availability, and lead times for your specific project requirements. We provide application support and can recommend alternative memory solutions if your design parameters require different specifications.