AS4C32M16D2-25BCNTR

IC DRAM 512MBIT PAR 84TFBGA
Part Description

IC DRAM 512MBIT PAR 84TFBGA

Quantity 522 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package84-TFBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeCommercial (Extended)
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 85°C (TC)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D2-25BCNTR - 512Mbit DDR2 SDRAM IC

The AS4C32M16D2-25BCNTR is a 512-megabit DDR2 SDRAM integrated circuit from Alliance Memory, organized as 32M x 16 bits. This parallel interface DRAM delivers reliable volatile memory performance with a 400MHz clock frequency and 0.4ns access time. Built for commercial applications requiring efficient synchronous dynamic memory, it provides a cost-effective solution for systems that need medium-density RAM with standard DDR2 operation.

Operating from a compact 84-pin TFBGA package measuring just 8mm x 12.5mm, this IC balances density and board space efficiency. It operates across a 0°C to 85°C temperature range with a supply voltage of 1.7V to 1.9V, making it well-suited for temperature-controlled environments and standard commercial electronics.

Key Features

  • Memory Architecture - 512Mbit capacity organized as 32 million words by 16 bits, providing flexible data width for parallel bus interfaces common in embedded systems and networking equipment.
  • DDR2 SDRAM Technology - Synchronous operation at 400MHz clock frequency with double data rate transfers, delivering efficient bandwidth for data-intensive tasks while maintaining industry-standard compatibility.
  • Fast Access Performance - 0.4ns access time and 15ns write cycle time ensure responsive memory operations for real-time processing and buffering applications.
  • Compact Package - 84-TFBGA package in an 8mm x 12.5mm footprint minimizes PCB space requirements while maintaining reliable ball grid array connections.
  • Low Voltage Operation - 1.7V to 1.9V supply voltage range reduces power consumption compared to older SDRAM technologies, supporting energy-conscious designs.
  • Commercial Temperature Range - 0°C to 85°C case temperature operation provides reliability for climate-controlled installations including office equipment and indoor networking infrastructure.

Typical Applications

  • Networking Equipment - This DDR2 SDRAM serves as packet buffer memory in switches and routers where its parallel interface and 400MHz operation support line-rate processing for moderate bandwidth connections.
  • Set-Top Boxes - The 512Mbit capacity provides sufficient working memory for video decoding and interface rendering in digital TV receivers and IPTV devices operating in temperature-controlled home environments.
  • Office Automation - Multi-function printers and copiers use this DRAM for image buffering and processing tasks where the parallel interface integrates readily with embedded processors and the commercial temperature range matches typical office conditions.
  • Point-of-Sale Systems - Retail terminals and payment processing devices leverage this memory for transaction buffering and display management, benefiting from the compact package size in space-constrained terminal designs.
  • Embedded Computing - Industrial PCs and embedded controllers utilize this SDRAM for program execution and data caching in applications where DDR2 compatibility aligns with existing system architectures.

Unique Advantages

  • Proven DDR2 Standard: Leverages mature and widely-supported DDR2 technology, simplifying integration with existing controller IP and reducing design validation time.
  • Balanced Density: 512Mbit capacity hits the sweet spot for applications that need more than 256Mbit but don't require the cost or complexity of gigabit-class devices.
  • Space-Efficient Footprint: The 84-TFBGA package delivers high density in under 100 square millimeters, allowing tighter board layouts without sacrificing memory capacity.
  • Standard Voltage Rails: 1.7V to 1.9V operation works with common voltage regulators used in DDR2 systems, eliminating the need for custom power supply designs.
  • Reliable Alliance Memory Source: Alliance Memory's focus on memory solutions ensures consistent availability and support for designs requiring a dependable supply chain partner.
  • Cost-Effective Performance: Provides the bandwidth and capacity needed for commercial applications without the premium pricing of specialized or extended-temperature memory variants.

Why Choose AS4C32M16D2-25BCNTR?

The AS4C32M16D2-25BCNTR represents a practical choice for engineers designing commercial electronics that require standard DDR2 SDRAM performance. Its 512Mbit capacity, parallel interface, and commercial temperature rating align with a wide range of applications from networking to office automation. The compact TFBGA package supports modern high-density board designs while the industry-standard DDR2 specification ensures compatibility with widely available memory controllers.

For designs where proven technology, reasonable cost, and reliable supply matter more than cutting-edge specifications, this Alliance Memory DRAM delivers the fundamentals. It suits systems with established DDR2 architectures that need a straightforward memory solution backed by a focused memory supplier.

Get a Quote Today

Ready to integrate the AS4C32M16D2-25BCNTR into your next design? Contact our sales team to discuss your memory requirements, request technical documentation, or receive a competitive quote tailored to your volume needs.

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