AS4C32M16D2-25BINTR

IC DRAM 512MBIT PAR 84TFBGA
Part Description

IC DRAM 512MBIT PAR 84TFBGA

Quantity 87 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package84-TFBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeAutomotive
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D2-25BINTR - 512Mbit DDR2 SDRAM

The AS4C32M16D2-25BINTR is a 512Mbit DDR2 SDRAM from Alliance Memory, Inc., organized as 32M x 16 with a parallel interface. This memory device operates at 400MHz clock frequency and is designed for applications requiring moderate-density volatile memory with DDR2 performance characteristics. It supports an extended temperature range of -40°C to 95°C (TC), making it suitable for industrial and harsh-environment applications.

Key Features

  • Memory Architecture - 512Mbit capacity organized as 32M x 16, providing flexible data width configuration for various system designs.
  • DDR2 SDRAM Technology - Double data rate architecture with 400MHz clock frequency delivers efficient data throughput while maintaining compatibility with standard DDR2 controllers.
  • Access Performance - 0.4ns access time with 15ns write cycle time ensures responsive memory operations for time-sensitive applications.
  • Power Supply - 1.7V to 1.9V operating voltage range aligns with standard DDR2 power specifications for straightforward integration.
  • Extended Temperature Range - Operates from -40°C to 95°C (case temperature), supporting deployment in industrial environments with temperature variations.
  • Compact Package - 84-TFBGA (8mm x 12.5mm) footprint provides space-efficient PCB layout options for size-constrained designs.

Typical Applications

  • Industrial Control Systems - This DDR2 SDRAM provides reliable working memory for PLCs, motion controllers, and process automation equipment where extended temperature tolerance ensures consistent operation in factory floor environments.
  • Embedded Computing - The 512Mbit capacity and parallel interface support embedded processors and SoCs in applications such as HMI terminals, data acquisition systems, and industrial PCs requiring moderate-density volatile memory.
  • Communications Equipment - Suitable for routers, switches, and network appliances where DDR2 performance meets buffering and packet processing requirements while the extended temperature range accommodates equipment room conditions.
  • Test and Measurement Instruments - Provides data storage for oscilloscopes, signal analyzers, and measurement devices where the 400MHz clock frequency supports real-time data capture and processing.

Unique Advantages

  • Extended Temperature Operation: The -40°C to 95°C range eliminates the need for additional thermal management in many industrial applications, reducing system complexity and cost.
  • Standard DDR2 Interface: Compatible with widely-available DDR2 memory controllers, simplifying design integration and reducing development time for established platforms.
  • Compact TFBGA Package: The small 8mm x 12.5mm footprint enables higher memory density per PCB area compared to larger package options, supporting miniaturization efforts.
  • Proven Technology: DDR2 SDRAM represents mature, well-understood technology with extensive design resources and controller support, reducing implementation risk.
  • Parallel Interface: Direct memory access without serialization overhead provides straightforward integration with processors and controllers featuring parallel memory buses.

Why Choose AS4C32M16D2-25BINTR?

The AS4C32M16D2-25BINTR is positioned for industrial and embedded applications where DDR2 performance, extended temperature operation, and moderate memory density align with system requirements. This component is particularly well-suited for designs upgrading from older memory technologies while maintaining compatibility with existing DDR2 infrastructure, or for new industrial systems where the extended temperature range provides operational reliability without premium pricing.

Note: This product has an Obsolete lifecycle status. Designers should contact Alliance Memory regarding availability and potential replacement options for new designs.

Get Started

Contact our technical sales team to discuss your memory requirements, verify current availability, and explore alternative solutions if needed. Our engineers can assist with integration guidance and recommend suitable replacements for ongoing production requirements.

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