AS4C32M16D2A-25BCN

IC DRAM 512MBIT PAR 84TFBGA
Part Description

IC DRAM 512MBIT PAR 84TFBGA

Quantity 1,680 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package84-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeExtended / Automotive-like
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 95°C (TC)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B2AHTS Code8542.32.0024

Overview of AS4C32M16D2A-25BCN - 512Mbit DDR2 SDRAM

The AS4C32M16D2A-25BCN from Alliance Memory is a 512Mbit DDR2 SDRAM organized as 32M x 16. This parallel interface DRAM operates at 400MHz clock frequency with 4ns access time, providing reliable high-speed memory for embedded systems and industrial applications. With an extended temperature range of 0°C to 95°C (case temperature), this device serves applications requiring robust memory performance in demanding thermal environments.

Key Features

  • DDR2 SDRAM Technology - Double Data Rate 2 architecture delivers 400MHz operation for efficient data throughput in memory-intensive applications.
  • 512Mbit Capacity (32M x 16 Organization) - Provides ample memory density in a compact footprint, optimized for 16-bit data bus architectures.
  • Fast Access Performance - 4ns access time and 15ns write cycle time ensure responsive memory operations for time-critical embedded systems.
  • Extended Temperature Operation - Rated for 0°C to 95°C case temperature operation, supporting deployment in industrial and commercial environments.
  • Standard 1.8V Operation - 1.7V to 1.9V supply voltage aligns with common DDR2 power rails, simplifying power management design.
  • Compact 84-TFBGA Package - 8mm x 12.5mm thin fine-pitch ball grid array minimizes PCB footprint while providing reliable solder connections.

Typical Applications

  • Industrial Control Systems - This DDR2 SDRAM provides working memory for PLCs, motor controllers, and process automation equipment where the extended temperature range ensures reliable operation in factory floor conditions.
  • Embedded Computing Platforms - Serves as system memory for single-board computers and embedded processors running Linux or real-time operating systems that require moderate memory capacity with DDR2 compatibility.
  • Network Infrastructure Equipment - Functions as buffer memory in routers, switches, and network appliances where the 400MHz clock speed supports packet processing and routing table storage.
  • Medical Instrumentation - Provides data storage for diagnostic equipment and patient monitoring systems that demand stable memory performance across varying environmental conditions.
  • Test and Measurement Instruments - Supports data acquisition and signal processing in oscilloscopes, spectrum analyzers, and automated test equipment requiring fast memory access for waveform capture.

Unique Advantages

  • Wide Temperature Tolerance: The 0°C to 95°C operating range reduces the need for additional thermal management in industrial installations.
  • Proven DDR2 Interface: Standard JEDEC-compatible DDR2 protocol ensures straightforward integration with existing controller designs and widespread software support.
  • Compact Form Factor: The 84-TFBGA package delivers high density in minimal PCB area, enabling smaller product designs or freeing board space for additional functionality.
  • Parallel Interface Simplicity: Direct parallel data access provides deterministic timing and straightforward interfacing compared to serial memory architectures.
  • Cost-Effective Capacity: 512Mbit density strikes a practical balance for embedded applications that have moved beyond smaller SRAMs but don't require gigabit-scale DRAM.

Why Choose AS4C32M16D2A-25BCN?

This DDR2 SDRAM is positioned for embedded and industrial applications that require proven memory technology with extended temperature operation. Designers working with legacy DDR2 controllers or maintaining existing product lines will find this device provides reliable performance in a compact package. The 32M x 16 organization is well-suited for 16-bit processor architectures common in industrial control and embedded computing.

Alliance Memory's focus on long-lifecycle memory products supports designs that require multi-year availability and consistent specifications. The device balances capacity, speed, and operating range for applications where DDR2 remains the appropriate memory technology choice.

Get AS4C32M16D2A-25BCN for Your Project

Contact our sales team to request a quote for the AS4C32M16D2A-25BCN or to discuss your specific memory requirements. Our technical support staff can assist with integration questions and help you select the optimal memory solution for your application.

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