AS4C32M16D2C-25BINTR

The AS4C32M16D2C-25BINTR from Alliance Memory is a 512Mbit DDR2 SDRAM device organized as 32M x 16 bits. Built on proven DDR2 technology, this memory IC delivers reliable performance with a 400MHz clock frequency and 4ns access time. Designed for extended temperature operation from -40°C to 95°C (case temperature), this DRAM is well-suited for industrial and embedded applications requiring consistent memory performance across demanding environmental conditions.

Key Features

• DDR2 SDRAM Architecture - Double data rate synchronous operation provides efficient data transfers at 400MHz clock frequency with SSTL_18 interface signaling for industry-standard compatibility.
• Memory Configuration - 32M x 16 bit organization provides 512Mbit total capacity with flexible word-level access for system designers.
• High-Speed Performance - 4ns access time and 15ns write cycle time support responsive memory operations for time-sensitive embedded applications.
• Extended Temperature Range - Specified for -40°C to 95°C case temperature operation, enabling deployment in industrial environments with elevated ambient temperatures.
• Compact Package - 84-pin FBGA (8mm x 12.5mm) footprint minimizes board space requirements while maintaining robust solder joint reliability.
• Low Voltage Operation - 1.7V to 1.9V supply voltage reduces system power consumption compared to older SDRAM technologies.

Typical Applications

• Industrial Control Systems - This DDR2 SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the extended temperature specification ensures reliable operation in factory floor environments without additional cooling requirements.
• Embedded Computing Modules - The compact 84-FBGA package and standard DDR2 interface make this memory suitable for system-on-module (SOM) designs and single-board computers where board space is constrained and thermal conditions may vary.
• Telecommunications Equipment - Network routers, switches, and base stations benefit from the reliable memory performance and extended temperature tolerance for installations in outdoor cabinets or equipment rooms with limited climate control.
• Medical Instrumentation - Diagnostic equipment and patient monitoring systems utilize this DRAM for data buffering and processing tasks where consistent performance across temperature variations maintains system reliability.
• Automotive Infotainment - In-vehicle displays and navigation systems leverage the memory capacity and extended temperature capability to operate reliably in the challenging thermal environment of automotive cabins.

Unique Advantages

• Proven DDR2 Technology: Mature, well-characterized interface simplifies board design and validation while leveraging existing controller IP and software drivers.
• Extended Temperature Tolerance: -40°C to 95°C case temperature specification reduces or eliminates the need for supplementary cooling systems in industrial enclosures.
• Simplified Bill of Materials: Single IC provides 512Mbit of memory capacity, reducing component count and simplifying inventory management compared to parallel memory configurations.
• Energy Efficient Design: DDR2 low-voltage operation and power management modes help meet system-level energy budgets in battery-backed or thermally constrained designs.
• Alliance Memory Reliability: Manufactured by Alliance Memory with focus on consistent supply and long-term availability for embedded and industrial product lifecycles.
• Standard Footprint: 84-FBGA package uses industry-standard dimensions and pinout conventions, facilitating second-source options and design portability.

Why Choose AS4C32M16D2C-25BINTR?

The AS4C32M16D2C-25BINTR addresses the needs of embedded system designers who require reliable DDR2 SDRAM with extended temperature capability. Its combination of 512Mbit density, 400MHz operation, and -40°C to 95°C specification makes it appropriate for industrial controllers, embedded computing platforms, and telecommunications infrastructure where environmental conditions exceed consumer-grade specifications. The compact FBGA package and low-voltage operation help optimize board-level design constraints.

This memory device is particularly valuable for designs with multi-year production horizons where consistent component availability and proven technology reduce supply chain risk and validation overhead.

Request a Quote

Contact our sales team to discuss volume pricing, delivery schedules, and technical support for the AS4C32M16D2C-25BINTR. Our application engineers can assist with design integration, thermal analysis, and board layout recommendations to ensure optimal performance in your specific application.