AS4C32M16D3-12BCNTR
| Part Description |
IC DRAM 512MBIT PARALLEL 96FBGA |
|---|---|
| Quantity | 1,027 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 96-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Extended / Automotive-like | ||
| Clock Frequency | 800 MHz | Voltage | 1.425V ~ 1.575V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 96-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16D3-12BCNTR - 512Mbit DDR3 SDRAM
The AS4C32M16D3-12BCNTR is a 512Mbit DDR3 SDRAM from Alliance Memory, Inc., organized as 32M x 16 with a parallel interface. This volatile memory device operates at 800MHz clock frequency and delivers 20ns access time, making it suitable for applications requiring fast data throughput and reliable temporary storage. With an extended operating temperature range of 0°C to 95°C (case temperature), this DRAM is designed for industrial and commercial systems that demand consistent performance across varying thermal conditions.
Key Features
- DDR3 SDRAM Technology - Double data rate architecture transfers data on both clock edges, effectively doubling bandwidth compared to single data rate memories for improved system performance.
- 512Mbit Memory Capacity (32M x 16 Organization) - Organized as 32 million words of 16 bits each, providing flexible memory addressing and efficient data access patterns for embedded applications.
- 800MHz Operating Frequency - Supports high-speed data transfers with 20ns access time, enabling responsive system operation in bandwidth-intensive applications.
- Extended Temperature Range (0°C to 95°C TC) - Case temperature rating allows deployment in industrial environments where ambient conditions may fluctuate beyond commercial standards.
- 1.5V Operation (1.425V ~ 1.575V) - Standard DDR3 voltage specification balances performance with power efficiency, reducing overall system power consumption compared to earlier DDR generations.
- 96-VFBGA Package (8x13mm) - Compact very fine-pitch ball grid array package minimizes PCB footprint while providing robust thermal and electrical performance for space-constrained designs.
Typical Applications
- Industrial Automation Systems - Provides working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and motion control systems where extended temperature tolerance ensures reliable operation in factory floor environments.
- Embedded Computing Platforms - Serves as main system memory in embedded computers, single-board computers, and ruggedized computing modules where DDR3 compatibility and industrial temperature ratings are required.
- Networking and Communications Equipment - Functions as buffer memory in routers, switches, and wireless access points, supporting packet processing and temporary data storage in telecommunications infrastructure operating across diverse environmental conditions.
- Test and Measurement Instruments - Enables high-speed data acquisition and processing in oscilloscopes, spectrum analyzers, and automated test equipment where fast access times support real-time measurement and analysis.
Unique Advantages
- Extended Temperature Reliability: The 0°C to 95°C case temperature rating enables deployment in industrial environments without requiring additional thermal management, reducing system complexity and cost.
- DDR3 Power Efficiency: Operating at 1.5V nominal voltage reduces power consumption compared to DDR2 alternatives while maintaining high performance, lowering total system energy requirements.
- Compact Footprint for Space-Constrained Designs: The 96-VFBGA package in 8x13mm dimensions allows higher memory density per board area, enabling more compact product designs or freeing space for additional functionality.
- Parallel Interface Simplicity: Standard parallel memory interface integrates readily with existing DDR3-compatible controllers and processors, reducing development time and design risk.
- 800MHz Performance: High clock frequency and 20ns access time support demanding applications requiring fast data throughput without bottlenecking system performance.
- Active Lifecycle Status: Currently active production status provides supply chain confidence and long-term availability for ongoing projects and product lifecycles.
Why Choose the AS4C32M16D3-12BCNTR?
The AS4C32M16D3-12BCNTR delivers proven DDR3 SDRAM technology in a compact package suited for industrial and embedded applications. Its extended temperature range, combined with standard DDR3 electrical characteristics and 800MHz operation, makes it an appropriate choice for designs requiring reliable volatile memory in variable thermal environments. The 96-VFBGA package supports high-density memory implementations while maintaining compatibility with established DDR3 controller architectures.
For designers developing industrial automation systems, embedded computing platforms, or networking equipment, this DRAM offers a balance of performance, power efficiency, and environmental tolerance. Alliance Memory's active production status supports both new designs and long-term product maintenance with predictable availability.
Get a Quote
Contact our sales team to discuss pricing, availability, and technical support for the AS4C32M16D3-12BCNTR. We can provide detailed specifications, sample units, and volume pricing to support your design requirements.
