AS4C32M16D3-12BINTR

IC DRAM 512MBIT PARALLEL 96FBGA
Part Description

IC DRAM 512MBIT PARALLEL 96FBGA

Quantity 630 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package96-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeAutomotive
Clock Frequency800 MHzVoltage1.425V ~ 1.575VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging96-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D3-12BINTR - 512Mbit DDR3 SDRAM

The AS4C32M16D3-12BINTR is a high-performance 512Mbit DDR3 SDRAM memory device from Alliance Memory, Inc. Organized as 32M x 16 and operating at 800MHz clock frequency, this parallel interface DRAM delivers reliable data storage and retrieval for embedded systems and computing applications. Its extended temperature range and compact 96-FBGA package make it well-suited for industrial and commercial designs requiring dependable volatile memory.

Key Features

  • DDR3 SDRAM Technology - Provides 512Mbit memory capacity with 32M x 16 organization, delivering efficient data access for memory-intensive applications.
  • High-Speed Operation - 800MHz clock frequency with 20ns access time enables rapid data throughput for time-critical operations.
  • Extended Temperature Range - Operates reliably from -40°C to 95°C (TC), supporting deployment in industrial environments with demanding thermal conditions.
  • Low Voltage Operation - 1.425V to 1.575V supply voltage reduces power consumption while maintaining performance.
  • Compact Package - 96-FBGA (8x13mm) surface mount package optimizes board space utilization in space-constrained designs.
  • Parallel Interface - Standard parallel memory interface simplifies integration with microcontrollers, processors, and FPGAs.

Typical Applications

  • Industrial Automation - This DDR3 SDRAM provides reliable working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial computers where the extended temperature rating ensures consistent operation in factory floor conditions.
  • Embedded Computing - Serves as system memory in embedded processors and single-board computers, offering the capacity and speed needed for running embedded operating systems and application software.
  • Networking Equipment - Functions as buffer memory in routers, switches, and network appliances where fast data access supports packet processing and routing operations.
  • Test and Measurement Instruments - Provides data storage for oscilloscopes, signal analyzers, and automated test equipment where the combination of speed and temperature tolerance supports accurate measurements in various environments.
  • Medical Devices - Supports data processing in diagnostic equipment and patient monitoring systems where reliable memory operation contributes to consistent device performance.

Unique Advantages

  • Extended Temperature Qualification: The -40°C to 95°C operating range eliminates the need for additional thermal management in many industrial applications, reducing system complexity and cost.
  • Standard DDR3 Interface: Compatibility with widespread DDR3 controller implementations accelerates design cycles and simplifies sourcing for production.
  • Compact Footprint: The 96-FBGA package delivers high memory density in minimal board area, enabling more compact product designs without sacrificing memory capacity.
  • Active Lifecycle Status: Current production availability supports long-term procurement for products with extended lifecycles, reducing obsolescence risk in multi-year deployments.
  • Alliance Memory Manufacturing: Sourced from an established memory specialist known for reliable supply and technical support for embedded memory solutions.

Why Choose AS4C32M16D3-12BINTR?

The AS4C32M16D3-12BINTR combines proven DDR3 SDRAM technology with industrial-grade temperature performance, making it an excellent choice for embedded and industrial systems requiring reliable volatile memory. Its 512Mbit capacity and 800MHz operation provide sufficient performance for a wide range of computing tasks, while the extended temperature rating and compact package support deployment in space-constrained and thermally challenging environments.

For engineering teams developing industrial controls, embedded computers, or instrumentation, this memory device offers a balance of performance, environmental tolerance, and industry-standard compatibility that can simplify both initial design and long-term production planning.

Get Started

To learn more about the AS4C32M16D3-12BINTR and how it can fit your specific application requirements, request a detailed quote or contact our technical sales team. We can provide additional specifications, pricing for volume requirements, and support for integrating this memory device into your design.

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