AS4C32M16D3L-12BCN
| Part Description |
IC DRAM 512MBIT PARALLEL 96FBGA |
|---|---|
| Quantity | 1,747 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 96-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Extended / Automotive-like | ||
| Clock Frequency | 800 MHz | Voltage | 1.283V ~ 1.45V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 96-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C32M16D3L-12BCN - 512Mbit DDR3 SDRAM with Extended Temperature Range
The AS4C32M16D3L-12BCN from Alliance Memory is a 512Mbit synchronous DRAM built on DDR3 technology, organized as 32M x 16. This parallel-interface memory device operates at clock frequencies up to 800MHz with a 20ns access time, making it well-suited for embedded systems requiring moderate density DRAM with extended temperature operation. The component supports applications demanding reliable data storage and retrieval in industrial and commercial environments.
Key Features
- Memory Configuration - 512Mbit total capacity organized as 32 million words by 16 bits, providing flexible data width for system integration.
- DDR3 SDRAM Technology - Volatile memory with synchronous operation at up to 800MHz clock frequency and 20ns access time for responsive read/write performance.
- Parallel Interface - Direct memory bus connection simplifies integration with processors and controllers that support parallel DRAM interfaces.
- Operating Voltage - 1.283V to 1.45V supply voltage range optimized for DDR3 low-power operation.
- Extended Temperature Range - Rated for 0°C to 95°C (case temperature) operation, supporting industrial-grade applications beyond standard commercial temperature limits.
- Compact 96-FBGA Package - 8mm x 13mm fine-pitch ball grid array package minimizes board space while providing reliable high-speed signal routing.
Typical Applications
- Industrial Control Systems - This DDR3 SDRAM provides working memory for programmable logic controllers and industrial computers where the extended temperature range ensures reliable operation in factory floor and outdoor enclosure environments.
- Embedded Computing Platforms - The 512Mbit capacity and parallel interface support processor-based embedded systems requiring moderate DRAM density for application code execution and data buffering.
- Networking Equipment - Network switches and routers use this memory for packet buffering and routing table storage, benefiting from the 800MHz operating frequency for high-throughput data processing.
- Test and Measurement Instruments - Benchtop and portable instrumentation leverage this SDRAM for waveform capture and signal processing where the extended temperature specification accommodates varied operating conditions.
- Medical Devices - Patient monitoring and diagnostic equipment utilize this memory for real-time data acquisition and display buffering in temperature-controlled medical environments.
Unique Advantages
- Industrial Temperature Tolerance: The 0°C to 95°C operating range extends usability beyond standard commercial components, reducing the need for specialized thermal management in industrial applications.
- Proven DDR3 Interface Compatibility: Widespread DDR3 controller support across processors and FPGAs simplifies design integration without custom memory interface development.
- Balanced Density and Performance: The 512Mbit capacity provides sufficient working memory for embedded applications without the power consumption and cost overhead of higher-density devices.
- Active Lifecycle Status: Ongoing production availability supports long-term product manufacturing and reduces obsolescence risk in industrial designs.
- Compact Form Factor: The 96-FBGA package delivers high pin density in a small footprint, enabling memory integration in space-constrained embedded designs.
- Standard Voltage Operation: DDR3-standard voltage requirements allow integration into existing power supply architectures without additional regulation circuitry.
Why Choose AS4C32M16D3L-12BCN?
The AS4C32M16D3L-12BCN addresses the needs of industrial and embedded system designers who require reliable DDR3 SDRAM with extended temperature operation. Its 0°C to 95°C specification makes it suitable for applications operating in challenging thermal environments while maintaining the performance characteristics of standard DDR3 technology. The 512Mbit density balances capacity with cost-effectiveness for applications that need moderate working memory without overspecification.
For engineers developing industrial control systems, embedded computing platforms, or ruggedized instrumentation, this component offers a combination of proven DDR3 interface compatibility, industrial temperature tolerance, and active production status that supports reliable long-term designs.
Get a Quote
Contact our sales team to discuss your memory requirements and receive pricing for the AS4C32M16D3L-12BCN. We provide technical support to help you evaluate this DDR3 SDRAM for your application and can assist with volume pricing and delivery scheduling.