AS4C32M16D3L-12BCN

IC DRAM 512MBIT PARALLEL 96FBGA
Part Description

IC DRAM 512MBIT PARALLEL 96FBGA

Quantity 1,747 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package96-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeExtended / Automotive-like
Clock Frequency800 MHzVoltage1.283V ~ 1.45VMemory TypeVolatile
Operating Temperature0°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging96-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D3L-12BCN - 512Mbit DDR3 SDRAM with Extended Temperature Range

The AS4C32M16D3L-12BCN from Alliance Memory is a 512Mbit synchronous DRAM built on DDR3 technology, organized as 32M x 16. This parallel-interface memory device operates at clock frequencies up to 800MHz with a 20ns access time, making it well-suited for embedded systems requiring moderate density DRAM with extended temperature operation. The component supports applications demanding reliable data storage and retrieval in industrial and commercial environments.

Key Features

  • Memory Configuration - 512Mbit total capacity organized as 32 million words by 16 bits, providing flexible data width for system integration.
  • DDR3 SDRAM Technology - Volatile memory with synchronous operation at up to 800MHz clock frequency and 20ns access time for responsive read/write performance.
  • Parallel Interface - Direct memory bus connection simplifies integration with processors and controllers that support parallel DRAM interfaces.
  • Operating Voltage - 1.283V to 1.45V supply voltage range optimized for DDR3 low-power operation.
  • Extended Temperature Range - Rated for 0°C to 95°C (case temperature) operation, supporting industrial-grade applications beyond standard commercial temperature limits.
  • Compact 96-FBGA Package - 8mm x 13mm fine-pitch ball grid array package minimizes board space while providing reliable high-speed signal routing.

Typical Applications

  • Industrial Control Systems - This DDR3 SDRAM provides working memory for programmable logic controllers and industrial computers where the extended temperature range ensures reliable operation in factory floor and outdoor enclosure environments.
  • Embedded Computing Platforms - The 512Mbit capacity and parallel interface support processor-based embedded systems requiring moderate DRAM density for application code execution and data buffering.
  • Networking Equipment - Network switches and routers use this memory for packet buffering and routing table storage, benefiting from the 800MHz operating frequency for high-throughput data processing.
  • Test and Measurement Instruments - Benchtop and portable instrumentation leverage this SDRAM for waveform capture and signal processing where the extended temperature specification accommodates varied operating conditions.
  • Medical Devices - Patient monitoring and diagnostic equipment utilize this memory for real-time data acquisition and display buffering in temperature-controlled medical environments.

Unique Advantages

  • Industrial Temperature Tolerance: The 0°C to 95°C operating range extends usability beyond standard commercial components, reducing the need for specialized thermal management in industrial applications.
  • Proven DDR3 Interface Compatibility: Widespread DDR3 controller support across processors and FPGAs simplifies design integration without custom memory interface development.
  • Balanced Density and Performance: The 512Mbit capacity provides sufficient working memory for embedded applications without the power consumption and cost overhead of higher-density devices.
  • Active Lifecycle Status: Ongoing production availability supports long-term product manufacturing and reduces obsolescence risk in industrial designs.
  • Compact Form Factor: The 96-FBGA package delivers high pin density in a small footprint, enabling memory integration in space-constrained embedded designs.
  • Standard Voltage Operation: DDR3-standard voltage requirements allow integration into existing power supply architectures without additional regulation circuitry.

Why Choose AS4C32M16D3L-12BCN?

The AS4C32M16D3L-12BCN addresses the needs of industrial and embedded system designers who require reliable DDR3 SDRAM with extended temperature operation. Its 0°C to 95°C specification makes it suitable for applications operating in challenging thermal environments while maintaining the performance characteristics of standard DDR3 technology. The 512Mbit density balances capacity with cost-effectiveness for applications that need moderate working memory without overspecification.

For engineers developing industrial control systems, embedded computing platforms, or ruggedized instrumentation, this component offers a combination of proven DDR3 interface compatibility, industrial temperature tolerance, and active production status that supports reliable long-term designs.

Get a Quote

Contact our sales team to discuss your memory requirements and receive pricing for the AS4C32M16D3L-12BCN. We provide technical support to help you evaluate this DDR3 SDRAM for your application and can assist with volume pricing and delivery scheduling.

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