AS4C32M16D3L-12BINTR

IC DRAM 512MBIT PARALLEL 96FBGA
Part Description

IC DRAM 512MBIT PARALLEL 96FBGA

Quantity 1,364 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package96-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeAutomotive
Clock Frequency800 MHzVoltage1.283V ~ 1.45VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging96-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C32M16D3L-12BINTR - 512Mbit DDR3L SDRAM with Extended Temperature Range

The AS4C32M16D3L-12BINTR is a 512Mbit low-voltage DDR3L SDRAM from Alliance Memory, organized as 32M x 16 and operating at 800MHz. This volatile memory device provides reliable data storage for embedded systems requiring reduced power consumption and extended temperature tolerance. With 1.35V nominal operation and qualification for -40°C to 95°C (case temperature), this SDRAM is designed for industrial, automotive, and communication applications where standard commercial-grade memory may not meet environmental requirements.

Key Features

  • DDR3L Low-Voltage Technology - Operates at 1.283V to 1.45V supply voltage, reducing power consumption compared to standard DDR3 while maintaining full DDR3 compatibility and performance.
  • Memory Configuration - 512Mbit density organized as 32M x 16, providing flexible integration options for systems requiring moderate memory capacity with 16-bit data paths.
  • High-Speed Performance - 800MHz clock frequency with 20ns access time enables fast data transfers for real-time processing and communication tasks.
  • Extended Temperature Operation - Qualified for -40°C to 95°C case temperature range, ensuring reliable operation in harsh industrial and automotive environments.
  • Compact Package - 96-VFBGA (8mm x 13mm) footprint minimizes board space requirements while providing robust parallel interface connectivity.

Typical Applications

  • Industrial Automation and Control - This DDR3L SDRAM provides reliable working memory for programmable logic controllers (PLCs), distributed control systems, and human-machine interfaces where extended temperature tolerance ensures consistent operation in factory floor and outdoor installations.
  • Networking and Communication Equipment - The 800MHz performance supports buffering and packet processing in routers, switches, and base stations, while low-voltage operation reduces thermal management requirements in densely packed rack-mounted systems.
  • Automotive Infotainment Systems - With its extended temperature range, this SDRAM serves as main memory for in-vehicle entertainment, navigation, and driver information displays that must operate reliably from cold starts to high cabin temperatures.
  • Medical Instrumentation - The combination of moderate density and industrial temperature rating makes this memory suitable for diagnostic equipment, patient monitoring systems, and portable medical devices requiring stable performance across varied operating environments.
  • Embedded Computing Platforms - This SDRAM integrates into single-board computers, industrial PCs, and embedded modules where the 512Mbit capacity balances cost efficiency with sufficient memory for operating systems and application workloads.

Unique Advantages

  • Reduced System Power Consumption: DDR3L operation at 1.35V nominal voltage decreases power draw and thermal output compared to standard DDR3, simplifying power supply design and thermal management.
  • Extended Reliability in Harsh Environments: Qualification to -40°C to 95°C case temperature eliminates the need for additional thermal protection in industrial and automotive applications, reducing system complexity and cost.
  • Proven SDRAM Technology: DDR3L architecture provides broad ecosystem support with mature controllers, software drivers, and design tools, accelerating development and reducing integration risk.
  • Compact Form Factor: The 96-FBGA package delivers high pin density in minimal board area, enabling more compact product designs without sacrificing memory capacity or interface performance.
  • Parallel Interface Simplicity: Direct parallel connectivity eliminates the need for complex serial protocol management, simplifying memory controller design and reducing latency in time-sensitive applications.
  • Active Lifecycle Status: Current production availability ensures long-term supply continuity for products with extended lifecycles, reducing obsolescence risk in industrial and infrastructure deployments.

Why Choose AS4C32M16D3L-12BINTR?

The AS4C32M16D3L-12BINTR addresses the specific requirements of industrial and embedded systems that demand both energy efficiency and environmental resilience. Its low-voltage operation reduces power budgets and thermal loads, while the extended temperature specification ensures stable performance across the full range of industrial operating conditions. This combination makes it particularly valuable for applications where commercial-grade memory would require costly thermal management solutions or face reliability concerns.

For design teams developing products with multi-year lifecycles, the active production status and proven DDR3L technology provide supply security and design confidence. The 512Mbit density strikes an optimal balance for moderate-performance embedded systems, while the compact FBGA package supports modern high-density board layouts without compromising signal integrity or thermal performance.

Get a Quote

Ready to integrate the AS4C32M16D3L-12BINTR into your next design? Contact our technical sales team for pricing, availability, and application support to ensure this DDR3L SDRAM meets your specific system requirements.

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